A pumping line arrangement includes a chamber connecting line which is fluidly connectable to a process chamber that forms part of a semiconductor fabrication tool. The pumping line arrangement also includes a valve module which is fluidly connected to the chamber connecting line. The valve module splits the chamber connecting line into respective first and second pumping lines. The first pumping line is intended to carry a first process flow and the second pumping line is intended to carry a second process flow which is incompatible with the first process flow. At least one of the first pumping line or the second pumping line includes fluidly connected therewithin a pre-abatement module that is configured to remove one or more incompatible constituents from the process flow intended to be carried by the other pumping line.