Invention Grant
- Patent Title: Electronic module, method of manufacturing connector, and method of manufacturing electronic module
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Application No.: US15782011Application Date: 2017-05-19
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Publication No.: US11437340B2Publication Date: 2022-09-06
- Inventor: Kosuke Ikeda , Osamu Matsuzaki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/018823 WO 20170519
- International Announcement: WO2018/211683 WO 20181122
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/07 ; H01L23/495 ; H01L21/48 ; H01L23/492 ; H01L23/498

Abstract:
An electronic module has a first electronic element 13, a first connector 60 provided in one side of the first electronic element 13, and having a first columnar part 62 extending to another side and a first groove part 64 provided in a one-side surface, and a second electronic element 23 provided in one side of the first connector 60 via a conductive adhesive agent provided inside a circumference of the first groove part 64. The first connector 60 has a first concave part 67 on one side at a position corresponding to the first columnar part 62.
Public/Granted literature
- US20200273833A1 ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF MANUFACTURING ELECTRONIC MODULE Public/Granted day:2020-08-27
Information query
IPC分类: