- 专利标题: Memory sub-system temperature control
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申请号: US17085671申请日: 2020-10-30
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公开(公告)号: US11442833B2公开(公告)日: 2022-09-13
- 发明人: Ting Luo , Tao Liu , Christopher J. Bueb , Eric Yuen , Cheng Cheng Ang
- 申请人: Micron Technology, Inc.
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Brooks, Cameron & Huebsch, PLLC
- 主分类号: G06F11/00
- IPC分类号: G06F11/00 ; G06F11/30 ; G06F11/07 ; G11C7/04 ; G11C11/406
摘要:
A method includes monitoring a temperature of a memory component of a memory sub-system to determine that the temperature of the memory component corresponds to a first monitored temperature value; writing data to the memory component of the memory sub-system while the temperature of the memory component corresponds to the first monitored temperature value; determining that the first monitored temperature value exceeds a threshold temperature range; monitoring the temperature of the memory component of the memory sub-system to determine that the temperature of the memory component corresponds to a second monitored temperature value that is within the threshold temperature range; and rewriting the data to the memory component of the memory sub-system while the temperature of the memory component corresponds to the second monitored temperature value.
公开/授权文献
- US20220138073A1 MEMORY SUB-SYSTEM TEMPERATURE CONTROL 公开/授权日:2022-05-05