Invention Grant
- Patent Title: Command buffer chip with dual configurations
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Application No.: US17284433Application Date: 2019-10-07
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Publication No.: US11443784B2Publication Date: 2022-09-13
- Inventor: Aws Shallal , Larry Grant Giddens
- Applicant: Rambus Inc.
- Applicant Address: US CA San Jose
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lowenstein Sandler LLP
- International Application: PCT/US2019/055028 WO 20191007
- International Announcement: WO2020/076718 WO 20200416
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G11C7/22 ; G11C11/4093

Abstract:
A buffer chip includes a first set of input/output (I/O) pins a second set of I/O pins, and is configurable to operate in one of a first mode or a second mode. The first set of I/O pins and the second set of I/O pins are configured to convey first signals between the buffer chip and one or more volatile memory devices on a memory module when the buffer chip is configured to operate in the first mode. The first set of I/O pins is configured to convey the first signals between the buffer chip and the one or more volatile memory devices and the second set of I/O pins is configured to convey second signals between more non-volatile memory devices on the memory module when the buffer chip is configured to operate in the second mode.
Public/Granted literature
- US20210343318A1 COMMAND BUFFER CHIP WITH DUAL CONFIGURATIONS Public/Granted day:2021-11-04
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