Invention Grant
- Patent Title: Redistribution structure for integrated circuit package and method of forming same
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Application No.: US17015370Application Date: 2020-09-09
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Publication No.: US11444034B2Publication Date: 2022-09-13
- Inventor: Chen-Hua Yu , An-Jhih Su , Der-Chyang Yeh , Li-Hsien Huang , Ming Shih Yeh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/538 ; H01L25/10 ; H01L23/00 ; H01L21/683 ; H01L21/48 ; H01L21/56 ; H01L25/065
Abstract:
A redistribution structure for a semiconductor device and a method of forming the same are provided. The semiconductor device includes a die encapsulated by an encapsulant, the die including a pad, and a connector electrically connected to the pad. The semiconductor device further includes a first via in physical contact with the connector. The first via is laterally offset from the connector by a first non-zero distance in a first direction. The first via has a tapered sidewall.
Public/Granted literature
- US20210358854A1 REDISTRIBUTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME Public/Granted day:2021-11-18
Information query
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