Disclosed herein are a solvent composition and methods of using the solvent composition. The solvent composition includes at least 80 wt. % of trans-1,2-dichloroetheylene (t-DCE), and 0.1 to 20 wt. % of at least one organic compound. The organic compound may be a hydrocarbon and/or an oxygenated solvent. The solvent composition may be used to clean a surface by contacting the surface with the composition to dissolve a contaminant on the surface. The composition may be used to remove a coating from a surface of a substrate by contacting the surface with the solvent composition to dissolve the coating and removing the composition containing the coating from the surface. The composition may also be used to deposit material on a substrate by dissolving the material in the solvent composition, applying the composition containing the material onto the substrate, and evaporating the composition from the substrate.