Invention Grant
- Patent Title: Patch substrate configured as a shield located over a cavity of a board
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Application No.: US17071408Application Date: 2020-10-15
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Publication No.: US11452246B2Publication Date: 2022-09-20
- Inventor: Charles David Paynter , Ryan Lane , John Eaton , Amit Mano
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP/Qualcomm
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K3/30 ; H05K5/00 ; H05K1/11
Abstract:
A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.
Public/Granted literature
- US20210307218A1 PATCH SUBSTRATE CONFIGURED AS A SHIELD LOCATED OVER A CAVITY OF A BOARD Public/Granted day:2021-09-30
Information query
