Invention Grant
- Patent Title: Automatic lay-up device
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Application No.: US17079848Application Date: 2020-10-26
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Publication No.: US11458694B2Publication Date: 2022-10-04
- Inventor: Isao Nishimura , Hideaki Aburano
- Applicant: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Ishikawa-ken
- Assignee: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Current Assignee: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Ishikawa-ken
- Agency: Paratus Law Group, PLLC
- Priority: JPJP2019-202027 20191107
- Main IPC: B29C70/38
- IPC: B29C70/38 ; B29C70/54

Abstract:
In an automatic lay-up device that lays up a long sheet-shaped thermosetting prepreg on a layer surface by moving, in a lay-up direction, a lay-up head including a raw-cloth roller around which the thermosetting prepreg is wound, a cutting device that cuts the thermosetting prepreg at a cutting angle, and a pressing device that presses the thermosetting prepreg against the layer surface, the automatic lay-up device includes a driving mechanism for moving the pressing device in a direction parallel to the width direction; and a drive controller that controls driving of the driving mechanism to start moving the pressing device when a cutting end of the thermosetting prepreg reaches a position of the pressing device.
Public/Granted literature
- US20210138742A1 AUTOMATIC LAY-UP DEVICE Public/Granted day:2021-05-13
Information query
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