- 专利标题: Radio frequency circuit and communication apparatus
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申请号: US16832295申请日: 2020-03-27
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公开(公告)号: US11463050B2公开(公告)日: 2022-10-04
- 发明人: Yusuke Naniwa , Hideki Muto , Hiroshi Nishikawa , Takashi Watanabe , Akiko Itabashi
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Pearne & Gordon LLP
- 优先权: JPJP2017-192117 20170929,JPJP2018-037779 20180302
- 主分类号: H03F3/187
- IPC分类号: H03F3/187 ; H03F3/195 ; H04B1/403 ; H05K1/16
摘要:
A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.
公开/授权文献
- US20200228074A1 RADIO FREQUENCY CIRCUIT AND COMMUNICATION APPARATUS 公开/授权日:2020-07-16
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