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公开(公告)号：US11387810B2
公开(公告)日：2022-07-12
申请号：US16720284
申请日：2019-12-19
发明人： Syuichi Onodera , Takashi Watanabe
摘要： A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.
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公开(公告)号：US11201633B2
公开(公告)日：2021-12-14
申请号：US17155987
申请日：2021-01-22
发明人： Takashi Watanabe
摘要： A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.
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公开(公告)号：US10985794B2
公开(公告)日：2021-04-20
申请号：US16413712
申请日：2019-05-16
发明人： Takashi Watanabe
IPC分类号： H04B1/44 , H03K17/693 , H04B1/00 , H04B1/18 , H04B1/405
摘要： A radio-frequency switch includes a first switch circuit including a first common terminal, at least two first selection terminals, a first switch that selectively connects the first common terminal and the at least two first selection terminals to each other, and a first shunt switch that switches the first common terminal and ground between a conductive state and a non-conductive state with each other, and a second switch circuit including a second common terminal that is connected to the first common terminal, at least two second selection terminals, and a second switch that selectively connects the second common terminal and the at least two selection terminals to each other.
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4.发明授权公开(公告)号：US09839135B2
公开(公告)日：2017-12-05
申请号：US14332652
申请日：2014-07-16
CPC分类号： H05K3/0052 , H01G2/065 , H05K1/141 , H05K3/3442 , H05K2201/049 , H05K2201/0909 , H05K2201/09181 , H05K2201/09645 , H05K2201/10636 , H05K2203/0191 , H05K2203/1563 , Y02P70/611 , Y10T29/4913
摘要： A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.
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公开(公告)号：US11476878B2
公开(公告)日：2022-10-18
申请号：US17453749
申请日：2021-11-05
发明人： Takashi Watanabe
摘要： A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.
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公开(公告)号：US10911080B2
公开(公告)日：2021-02-02
申请号：US16799303
申请日：2020-02-24
发明人： Takashi Watanabe
摘要： An amplifier circuit unit of a radio frequency module is mounted on a substrate with a first external terminal interposed therebetween, a switch circuit unit is mounted on the substrate with a second external terminal interposed therebetween, and a matching circuit unit is mounted on the substrate with a first terminal and a second terminal interposed therebetween. The first terminal is electrically connected to the second external terminal of the switch circuit unit, and the second terminal is electrically connected to the first external terminal of the amplifier circuit unit. When viewed from a direction perpendicular to one main surface of the substrate, the first terminal is superposed with the second external terminal of the switch circuit unit, and the second terminal is superposed with the first external terminal of the amplifier circuit unit.
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公开(公告)号：US10530409B2
公开(公告)日：2020-01-07
申请号：US16237785
申请日：2019-01-02
发明人： Takashi Watanabe
摘要： A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.
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公开(公告)号：US09801283B2
公开(公告)日：2017-10-24
申请号：US14334688
申请日：2014-07-18
发明人： Kazuto Ogawa , Takashi Watanabe , Junya Shimakawa
CPC分类号： H05K3/0052 , H05K1/141 , H05K3/3442 , H05K2201/049 , H05K2201/0909 , H05K2201/09181 , H05K2201/09645 , H05K2201/10636 , H05K2203/0191 , H05K2203/1563 , Y02P70/611 , Y10T29/4913
摘要： A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal is performed such that the substrate-type terminal includes a substrate body including a rectangular or substantially rectangular first principal surface extending in first and second directions perpendicular or substantially perpendicular to each other. The device is disposed on the first principal surface. The method includes supporting a substrate that is to become an assembly in which the plurality of substrate-type terminals are arranged in a matrix using a first support member, cutting the substrate supported by the first support member into the plurality of substrate-type terminals, and mounting the device on the first principal surface of the substrate body of each of the plurality of substrate-type terminals obtained by cutting.
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公开(公告)号：US11784669B2
公开(公告)日：2023-10-10
申请号：US17457699
申请日：2021-12-06
发明人： Takashi Watanabe
CPC分类号： H04B1/0078 , H04B1/0458 , H04B1/1607 , H04B2001/0408
摘要： A radio-frequency module includes a module substrate having a major surface on which a ground electrode pattern is formed and an integrated circuit disposed on the major surface of the module substrate. The integrated circuit includes a control/power supply circuit having at least one of a control circuit and a power supply circuit and a second electrical circuit having at least one of an amplifier, a switch, and a filter. In plan view, the ground electrode pattern overlaps at least a part of the control/power supply circuit and does not overlap at least a part of the second electrical circuit.
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公开(公告)号：US11855671B2
公开(公告)日：2023-12-26
申请号：US17838454
申请日：2022-06-13
发明人： Takashi Watanabe
CPC分类号： H04B1/16 , H03H7/38 , H03H9/64 , H03H9/72 , H03H11/362 , H03H2007/386 , H03H2250/00
摘要： A radio-frequency module includes a first terminal, a second terminal, a first switch including a first switch terminal connected to the first terminal and a second switch terminal connectable to the first switch terminal, a second switch including a third switch terminal connectable to the second terminal, a first filter connected between the second switch terminal and the third switch terminal, and a substrate. The first switch and the second switch are included in a single semiconductor chip. The first filter and the semiconductor chip are on the substrate. In a plan view of the substrate, a first distance between the third switch terminal and the first switch terminal or a second distance between the third switch terminal and the second switch terminal is greater than a third distance between the first switch terminal and the second switch terminal.
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