Invention Grant
- Patent Title: Stress measurement method, stress measurement device, and stress measurement system
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Application No.: US16527582Application Date: 2019-07-31
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Publication No.: US11467046B2Publication Date: 2022-10-11
- Inventor: Yousuke Irie , Hirotsugu Inoue , Takuya Niioka
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-023497 20170210
- Main IPC: G01L1/10
- IPC: G01L1/10 ; H01J37/22 ; H01J37/26 ; G01L1/24 ; G01N3/08 ; G01N3/32 ; G01N3/06

Abstract:
In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.
Public/Granted literature
- US20190353538A1 STRESS MEASUREMENT METHOD, STRESS MEASUREMENT DEVICE, AND STRESS MEASUREMENT SYSTEM Public/Granted day:2019-11-21
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