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Patent Agency Ranking
公开(公告)号：US11054252B2
公开(公告)日：2021-07-06
申请号：US16047373
申请日：2018-07-27
Inventor： Yousuke Irie , Hirotsugu Inoue , Shogo Tokunaga , Yu Kurokawa , Takuya Niioka
Abstract: Method for measuring a depth of a defect inside an inspection object is provided. The method comprises steps of: generating thermal image data corresponding to a temperature of a surface of the inspection object by photographing a heated surface of the inspection object at a predetermined time interval by a photographing device; obtaining a temperature curve showing a temporal change in temperature of the surface of the inspection object based on the thermal image data; fitting a theoretical equation obtained from a heat conduction equation including a parameter related to the depth of the defect of the inspection object to the temperature curve to obtain a theoretical curve showing a temporal change in temperature of the surface of the inspection object; and obtaining the depth of the defect of the inspection object based on a value of the parameter in the theoretical equation corresponding to the theoretical curve.
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公开(公告)号：US11965735B2
公开(公告)日：2024-04-23
申请号：US17395867
申请日：2021-08-06
Inventor： Yousuke Irie , Hirotsugu Inoue , Koutaro Sakamoto
CPC classification number: G01B21/085 , G01J5/0003 , G01N25/72 , G01J2005/0077 , G01K3/04 , G01K3/06
Abstract: A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
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公开(公告)号：US11275005B2
公开(公告)日：2022-03-15
申请号：US16449777
申请日：2019-06-24
Inventor： Yousuke Irie , Hirotsugu Inoue , Ryougo Kawai
Abstract: A fatigue limit stress specification system includes: a vibration generator that repeatedly applies a load to an object to be measured; a temperature sensor that measures a change in temperature of the object to be measured; and an information processing device that measures a fatigue limit stress of the object to be measured. The information processing device obtains a relation between a temperature amplitude of a fundamental frequency component of vibration for the object to be measured and a temperature amplitude of a second harmonic component of the vibration, performs fitting on the relation by using a first approximate line and a second approximate line, the first approximate line including a quadratic curve, the second approximate line including a quadratic curve, and obtains the fatigue limit stress of the object to be measured based on an intersection of the first approximate line and the second approximate line.
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公开(公告)号：US12073549B2
公开(公告)日：2024-08-27
申请号：US17679298
申请日：2022-02-24
Inventor： Yousuke Irie , Hirotsugu Inoue , Michiyasu Hirota
CPC classification number: G06T7/0004 , G01K11/26 , G06T2207/20212 , G06T2207/30108
Abstract: A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.
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公开(公告)号：US11467046B2
公开(公告)日：2022-10-11
申请号：US16527582
申请日：2019-07-31
Inventor： Yousuke Irie , Hirotsugu Inoue , Takuya Niioka
Abstract: In a stress measurement method, an object to be measured is vibrated at a plurality of oscillation frequencies, and a temperature amplitude of the object to be measured is measured by using a temperature sensor. Parameters of a one-dimensional heat conduction equation described below are identified by performing curve-fitting, on the basis of the one-dimensional heat conduction equation, on a measurement value of the temperature amplitude with respect to frequency characteristics of a temperature change component and a phase component based on a thermoelastic effect. The frequency characteristics are obtained at the plurality of oscillation frequencies. The one-dimensional heat conduction equation indicates a theoretical solution of a temperature amplitude on a surface of a coating film based on heat conduction and the thermoelastic effect of each of a substrate and the coating film. Then, a stress of the object to be measured is obtained based on the identified parameters.
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