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公开(公告)号：US11906370B2
公开(公告)日：2024-02-20
申请号：US17124735
申请日：2020-12-17
Inventor： Yousuke Irie , Ryoji Hirose
IPC: G01N25/72 , G01K5/56 , G01M5/00 , G01L1/24 , G01M99/00 , G01M11/08 , G06T7/00 , G06T7/20 , H04N5/33 , G01G19/02
CPC classification number: G01K5/56 , G01L1/248 , G01M5/0008 , G01M5/0091 , G01M11/081 , G01M99/002 , G01N25/72 , G06T7/0004 , G06T7/20 , H04N5/33 , G01G19/022 , G06T2207/10048 , G06T2207/20056 , G06T2207/30132 , G06T2207/30236
Abstract: A method is disclosed for measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first data by sensing, through a first sensing unit, of a moving object or an identification display object attached to the structural object; calculating, based on the first data, a movement duration in which the moving object moves between the support parts; generating, as second data, thermal data by sensing of a surface of the beam part through a second sensing unit; calculating a temperature change amount based on a second data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.
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公开(公告)号：US11761833B2
公开(公告)日：2023-09-19
申请号：US17085403
申请日：2020-10-30
Inventor： Yousuke Irie
IPC: G01L1/24 , G01K3/10 , G01J5/00 , H04N5/33 , H04N7/18 , G01B11/16 , G01L1/00 , G01M5/00 , G01N25/20 , G01N25/72 , G01M99/00 , G01M11/08
CPC classification number: G01L1/248 , G01B11/16 , G01J5/0003 , G01K3/10 , G01L1/00 , G01M5/0008 , G01M5/0091 , G01M11/081 , G01M99/002 , G01N25/20 , G01N25/72 , H04N5/33 , H04N7/181 , G01J2005/0077
Abstract: A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.
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公开(公告)号：US12066343B2
公开(公告)日：2024-08-20
申请号：US17467836
申请日：2021-09-07
Inventor： Yousuke Irie
CPC classification number: G01L1/248 , G01J5/0003 , G01J2005/0077 , G06T7/20 , G06T2207/10048 , G06T2207/30236 , H04N5/33
Abstract: A stress properties measurement method for measuring properties of stresses generated in a structure includes acquiring, from a first imaging device, a plurality of thermal images corresponding to temperatures of a surface of the structure, the plurality of thermal images being different in imaging time from each other, generating a stress distribution image corresponding to each of the plurality of thermal images, acquiring a stress value of a first section that is smaller in stress gradient than a predetermined value and respective stress values of a plurality of second sections where stresses are concentrated for the stress distribution images, and deriving correlation properties of stresses at a section of the structure based on the stress value of the first section acquired and the respective stress values of the plurality of second sections acquired.
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公开(公告)号：US11808657B2
公开(公告)日：2023-11-07
申请号：US17563627
申请日：2021-12-28
Inventor： Yousuke Irie
CPC classification number: G01M11/081 , G01L1/248 , G01M5/0008
Abstract: A stress distribution image processing device including:
a processing unit configured to:
designate a normalization region which includes a portion of stress equal to or larger than a predetermined threshold value in a screen of a stress distribution image of a target object; and
normalize pixels in the normalization region based on stress values in the normalization region to obtain a normalized image.-
公开(公告)号：US11054252B2
公开(公告)日：2021-07-06
申请号：US16047373
申请日：2018-07-27
Inventor： Yousuke Irie , Hirotsugu Inoue , Shogo Tokunaga , Yu Kurokawa , Takuya Niioka
Abstract: Method for measuring a depth of a defect inside an inspection object is provided. The method comprises steps of: generating thermal image data corresponding to a temperature of a surface of the inspection object by photographing a heated surface of the inspection object at a predetermined time interval by a photographing device; obtaining a temperature curve showing a temporal change in temperature of the surface of the inspection object based on the thermal image data; fitting a theoretical equation obtained from a heat conduction equation including a parameter related to the depth of the defect of the inspection object to the temperature curve to obtain a theoretical curve showing a temporal change in temperature of the surface of the inspection object; and obtaining the depth of the defect of the inspection object based on a value of the parameter in the theoretical equation corresponding to the theoretical curve.
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Patent Agency Ranking
公开(公告)号：US12092538B2
公开(公告)日：2024-09-17
申请号：US17536991
申请日：2021-11-29
Inventor： Yousuke Irie
CPC classification number: G01L1/248 , G06T7/246 , G06T2207/10048
Abstract: A stress analysis device for moving body, includes: an infrared camera that captures an infrared image of a moving body while making a relative movement with respect to the moving body; and an image processing unit that performs image processing on a plurality of the infrared images captured by the infrared camera. The image processing unit includes: an alignment unit that aligns portions of an object included in the moving body in the plurality of the infrared images including the object, and a stress distribution calculation unit that calculates temperature changes of each of the portions of the object to obtain stress distributions of the portions of the object based on the temperature changes.
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公开(公告)号：US11965735B2
公开(公告)日：2024-04-23
申请号：US17395867
申请日：2021-08-06
Inventor： Yousuke Irie , Hirotsugu Inoue , Koutaro Sakamoto
CPC classification number: G01B21/085 , G01J5/0003 , G01N25/72 , G01J2005/0077 , G01K3/04 , G01K3/06
Abstract: A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
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公开(公告)号：US11275005B2
公开(公告)日：2022-03-15
申请号：US16449777
申请日：2019-06-24
Inventor： Yousuke Irie , Hirotsugu Inoue , Ryougo Kawai
Abstract: A fatigue limit stress specification system includes: a vibration generator that repeatedly applies a load to an object to be measured; a temperature sensor that measures a change in temperature of the object to be measured; and an information processing device that measures a fatigue limit stress of the object to be measured. The information processing device obtains a relation between a temperature amplitude of a fundamental frequency component of vibration for the object to be measured and a temperature amplitude of a second harmonic component of the vibration, performs fitting on the relation by using a first approximate line and a second approximate line, the first approximate line including a quadratic curve, the second approximate line including a quadratic curve, and obtains the fatigue limit stress of the object to be measured based on an intersection of the first approximate line and the second approximate line.
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公开(公告)号：US10900844B2
公开(公告)日：2021-01-26
申请号：US16101812
申请日：2018-08-13
Inventor： Yousuke Irie , Ryoji Hirose
IPC: G01M5/00 , G01K5/56 , G01L1/24 , G01M99/00 , G01M11/08 , G01N25/72 , G06T7/00 , G06T7/20 , H04N5/33 , G01G19/02
Abstract: A stress distribution measurement method is a method of measuring stress distribution generated on a structural object including two support parts and a beam part provided between the support parts. The method includes: generating first image data by performing, through a first image capturing unit, image capturing of a moving object or an identification display object attached to the structural object from the moving object; calculating, based on the first image data, a movement duration in which the moving object moves between the support parts; generating, as second image data, thermal image data by performing image capturing of the surface of the beam part through a second image capturing unit; calculating a temperature change amount based on a second image data group corresponding to the movement duration; and calculating a stress change amount based on the temperature change amount to calculate stress distribution based on the stress change amount.
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公开(公告)号：US12073549B2
公开(公告)日：2024-08-27
申请号：US17679298
申请日：2022-02-24
Inventor： Yousuke Irie , Hirotsugu Inoue , Michiyasu Hirota
CPC classification number: G06T7/0004 , G01K11/26 , G06T2207/20212 , G06T2207/30108
Abstract: A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.
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