Invention Grant
- Patent Title: Electronic device with sealing structure
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Application No.: US16510733Application Date: 2019-07-12
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Publication No.: US11470409B2Publication Date: 2022-10-11
- Inventor: Wontae Jeong , Eungkyu Park , Dongyeop Lee , Yonghwa Kim , Gihoon Lee , Jaehwan Lee , Seungbum Choi , Hyounggil Choi , Changryong Heo
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2018-0108821 20180912
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02 ; H05K5/03 ; H05K5/06 ; H04R1/02 ; H01F38/14 ; H01M50/24 ; H01M50/209

Abstract:
An electronic device may include: a housing including a front plate oriented in a first direction, a rear plate oriented in a second direction opposite the first direction, and a side member enclosing at least a part of a space between the front plate and the rear plate. The electronic device further including a display disposed to be visible through the front plate; a printed circuit board disposed between the display and the rear plate; a support structure having a first face oriented in the first direction and supporting the display and a second face oriented in the second direction and supporting the printed circuit board; a conductive member disposed between the support structure and the rear plate; and a sealing structure disposed between the conductive member and the rear plate, the sealing structure extending along a periphery of the conductive member and formed in a closed curve shape.
Public/Granted literature
- US20200084528A1 ELECTRONIC DEVICE WITH SEALING STRUCTURE Public/Granted day:2020-03-12
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