Invention Grant
- Patent Title: Offset hinge assembly for mobile compute devices
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Application No.: US17227962Application Date: 2021-04-12
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Publication No.: US11474568B2Publication Date: 2022-10-18
- Inventor: Bijendra Singh , Prakash Kurma Raju , Prasanna Pichumani , Kathiravan D
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Priority: IN201841048649 20181221
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
Public/Granted literature
- US20210232184A1 OFFSET HINGE ASSEMBLY FOR MOBILE COMPUTE DEVICES Public/Granted day:2021-07-29
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