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    THERMAL COOLING SYSTEM
    4.
    发明申请
    THERMAL COOLING SYSTEM 审中-公开

    公开(公告)号：US20190045665A1

    公开(公告)日：2019-02-07

    申请号：US16146927

    申请日：2018-09-28

    Applicant: Intel Corporation

    Inventor： Bijendra Singh ,  Sachin Bedare

    IPC: H05K7/20 ,  C09K5/06

    CPC classification number: H01L23/4275 ,  G06F1/20 ,  H05K1/02 ,  H05K7/2029 ,  H05K7/20463 ,  H05K7/205

    Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.

    Hybrid keyboard
    5.
    发明授权
    Hybrid keyboard 有权

    公开(公告)号：US10963015B2

    公开(公告)日：2021-03-30

    申请号：US16728632

    申请日：2019-12-27

    Applicant: Intel Corporation

    Inventor： Arnab Sen ,  Bijendra Singh

    IPC: G06F1/16 ,  G06F1/20 ,  H05K7/20 ,  H01H9/52 ,  H01H13/88 ,  H01H13/70

    Abstract: Particular embodiments described herein provide for an electronic device that includes a hybrid keyboard. The keyboard can include a first portion of keys with a first key travel and a second portion of keys with a second key travel. The second key travel is less than the first key travel and a support plate can be raised under the second portion of keys and cause the second portion of keys to have the second key travel. In an example, a heat pipe or some other component can be located under the raised support plate and second portion of keys with the second key travel.

    Thermal cooling system
    6.
    发明授权
    Thermal cooling system 有权

    公开(公告)号：US10403560B2

    公开(公告)日：2019-09-03

    申请号：US16146927

    申请日：2018-09-28

    Applicant: Intel Corporation

    Inventor： Bijendra Singh ,  Sachin Bedare

    IPC: H01L23/427 ,  H05K7/20 ,  H05K1/02 ,  C09K5/06 ,  G06F1/20

    Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.

    OFFSET HINGE ASSEMBLY FOR MOBILE COMPUTE DEVICES
    8.
    发明申请
    OFFSET HINGE ASSEMBLY FOR MOBILE COMPUTE DEVICES 审中-公开

    公开(公告)号：US20190179377A1

    公开(公告)日：2019-06-13

    申请号：US16274818

    申请日：2019-02-13

    Applicant: Intel Corporation

    Inventor： Bijendra Singh ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  Kathiravan D

    IPC: G06F1/16

    Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.

    Thermal solutions for package on package (PoP) architectures
    10.
    发明授权
    Thermal solutions for package on package (PoP) architectures 有权

    公开(公告)号：US11538731B2

    公开(公告)日：2022-12-27

    申请号：US16368049

    申请日：2019-03-28

    Applicant: Intel Corporation

    Inventor： Bijendra Singh ,  Vikas Rao ,  Sandesh Geejagaaru Krishnamurthy ,  Navneet Kumar Singh ,  Unnikrishnan Gopinanthan Pillai

    IPC: H01L23/367 ,  H01L23/498 ,  H01L23/48

    Abstract: Embodiments disclosed herein include electronic packages with improved thermal performance. In an embodiment, the electronic package comprises a first package substrate, a first die stack over the first package substrate, and a heat spreader over the first die stack. In an embodiment, the heat spreader comprises arms that extend out past sidewalls of the first package substrate. In an embodiment, the electronic package further comprises an interposer over and around the heat spreader, where the interposer is electrically coupled to the first package substrate by a plurality of interconnects. In an embodiment, the electronic package further comprises a second package substrate over the interposer, and a second die over the second package substrate.

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