Invention Grant
- Patent Title: Conformal transfer doping method for fin-like field effect transistor
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Application No.: US17121007Application Date: 2020-12-14
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Publication No.: US11476352B2Publication Date: 2022-10-18
- Inventor: Sai-Hooi Yeong , Sheng-Chen Wang , Bo-Yu Lai , Ziwei Fang , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L21/225 ; H01L29/66 ; H01L29/165

Abstract:
Doping techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes forming a fin structure, forming a doped amorphous layer over a portion of the fin structure, and performing a knock-on implantation process to drive a dopant from the doped amorphous layer into the portion of the fin structure, thereby forming a doped feature. The doped amorphous layer includes a non-crystalline form of a material. In some implementations, the knock-on implantation process crystallizes at least a portion of the doped amorphous layer, such that the portion of the doped amorphous layer becomes a part of the fin structure. In some implementations, the doped amorphous layer includes amorphous silicon, and the knock-on implantation process crystallizes a portion of the doped amorphous silicon layer.
Public/Granted literature
- US20210134985A1 Conformal Transfer Doping Method for Fin-Like Field Effect Transistor Public/Granted day:2021-05-06
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