Invention Grant
- Patent Title: Electronic component
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Application No.: US16715245Application Date: 2019-12-16
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Publication No.: US11482371B2Publication Date: 2022-10-25
- Inventor: Shinichi Sato , Yohei Tadaki , Akihiko Oide , Yuma Ishikawa , Hidekazu Sato , Kazuhiro Ebina , Hiroyuki Tanoue
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2016-085495 20160421,JPJP2016-085496 20160421,JPJP2016-089425 20160427
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F17/00 ; H01F27/29 ; H01F27/32 ; H01F41/04 ; H01F41/12

Abstract:
An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
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