- Patent Title: High electron mobility transistor and fabrication method thereof
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Application No.: US17337415Application Date: 2021-06-03
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Publication No.: US11489048B2Publication Date: 2022-11-01
- Inventor: Shin-Chuan Huang , Chih-Tung Yeh , Chun-Ming Chang , Bo-Rong Chen , Wen-Jung Liao , Chun-Liang Hou
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201911086103.3 20191108
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/20 ; H01L29/78 ; H01L29/205 ; H01L29/423 ; H01L29/66

Abstract:
A method for forming a high-electron mobility transistor is disclosed. A substrate is provided. A buffer layer is formed over the substrate. A GaN channel layer is formed over the buffer layer. An AlGaN layer is formed over the GaN channel layer. A GaN source layer and a GaN drain layer are formed on the AlGaN layer within a source region and a drain region, respectively. A gate recess is formed in the AlGaN layer between the source region and the drain region. A p-GaN gate layer is then formed in and on the gate recess.
Public/Granted literature
- US20210288149A1 HIGH ELECTRON MOBILITY TRANSISTOR AND FABRICATION METHOD THEREOF Public/Granted day:2021-09-16
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