Invention Grant
- Patent Title: Interposer printed circuit boards for power modules
-
Application No.: US16528510Application Date: 2019-07-31
-
Publication No.: US11490517B2Publication Date: 2022-11-01
- Inventor: John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
- Applicant: ABB Power Electronics Inc.
- Applicant Address: US TX Plano
- Assignee: ABB Power Electronics Inc.
- Current Assignee: ABB Power Electronics Inc.
- Current Assignee Address: US TX Plano
- Agency: Armstrong Teasdale LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/14 ; H01L23/00 ; H01L23/34 ; H01L23/48 ; H01L23/58 ; H01L23/64 ; H01L23/66 ; H01L23/498 ; H01Q1/22 ; H01Q1/24 ; H01Q9/04
Abstract:
Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
Public/Granted literature
- US20210037649A1 INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES Public/Granted day:2021-02-04
Information query
