- 专利标题: Epoxy compound, resist composition, and pattern forming process
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申请号: US16800447申请日: 2020-02-25
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公开(公告)号: US11492337B2公开(公告)日: 2022-11-08
- 发明人: Masayoshi Sagehashi , Ryosuke Taniguchi , Takeru Watanabe , Yoshinori Matsui
- 申请人: Shin-Etsu Chemical Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: WHDA, LLP
- 优先权: JPJP2019-040260 20190306
- 主分类号: C07D303/06
- IPC分类号: C07D303/06 ; G03F7/004 ; G03F7/038 ; G03F7/039 ; C08F212/08 ; C08F220/38 ; C08L33/14
摘要:
An epoxy compound of formula (1) is provided. A resist composition comprising the epoxy compound is capable of adequately controlling the diffusion length of acid generated from an acid generator without sacrificing sensitivity.