Invention Grant
- Patent Title: Device substrate with asymmetrical fan-out lines and spliced electronic apparatus using the same
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Application No.: US16439722Application Date: 2019-06-13
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Publication No.: US11495646B2Publication Date: 2022-11-08
- Inventor: Chan-Jui Liu , Chun-Cheng Cheng
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW108108862 20190315
- Main IPC: H01L27/32
- IPC: H01L27/32 ; G02F1/1333 ; G02F1/1345

Abstract:
A device substrate includes a carrier, a device array, first fan-out lines, and second fan-out lines. The carrier has a first side, a second side, a third side, and a fourth side. The first side is opposite to the second side. The third side is opposite to the fourth side. The device array is disposed on a first surface of the carrier. The device array includes sub-pixels. Each of the sub-pixels includes a switching element and an optoelectronic element electrically connected with the switching element. The first fan-out lines are extending from the first side to the first surface and electrically connected with the device array. The second fan-out lines are extending from the second side to the first surface and electrically connected with the device array. The first fan-out lines and the second fan-out lines are asymmetrically disposed on the first side and the second side, respectively.
Public/Granted literature
- US20200295107A1 DEVICE SUBSTRATE AND SPLICED ELECTRONIC APPARATUS Public/Granted day:2020-09-17
Information query
IPC分类: