公开(公告)号：US20220376150A1

公开(公告)日：2022-11-24

申请号：US17519556

申请日：2021-11-04

Applicant: Au Optronics Corporation

Inventor： Hsun-Yi Wang ,  Chan-Jui Liu ,  Chiao-Li Huang ,  Ching-Liang Huang ,  Chun-Cheng Cheng

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62 ,  G06F3/044 ,  G06F3/041

Abstract: A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.

公开(公告)号：US20210217807A1

公开(公告)日：2021-07-15

申请号：US17105410

申请日：2020-11-25

Applicant: Au Optronics Corporation

Inventor： Chan-Jui Liu ,  Chen-Chi Lin ,  Chun-Cheng Cheng

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/00 ,  G09G3/00

Abstract: A display apparatus, including a substrate, a conductive structure, a pixel unit, a signal line, a transmission line, and a repair structure, is provided. The substrate has a first surface, a second surface, and a through hole. The conductive structure is disposed in the through hole. The pixel unit is disposed on the first surface. The pixel unit includes first, second, third, and fourth connection pads, a driving element, and a light-emitting element. The light-emitting element is electrically connected to the first and second connection pads. The signal line is disposed on the first surface. The driving element is electrically connected to the first and third connection pads through the signal line. The transmission line is disposed on the second surface and electrically connected to the second or fourth connection pad at least through the conductive structure. The repair structure is disposed between the transmission line and the conductive structure.

公开(公告)号：US20210216116A1

公开(公告)日：2021-07-15

申请号：US17111482

申请日：2020-12-03

Applicant: Au Optronics Corporation

Inventor： Chan-Jui Liu ,  Chun-Cheng Cheng ,  Pin-Miao Liu

IPC: G06F1/18 ,  G09F9/30

Abstract: A flexible electronic device including a flexible substrate, a plurality of first signal lines, a plurality of first transmission lines, a plurality of first through holes, and a plurality of first conductive structures is provided. The flexible substrate has a first surface and a second surface opposite to the first surface. The first signal lines are located on the first surface and have a first extending direction. The first transmission lines are located on the second surface and have a second extending direction. A first included angle is provided between the first extending direction and the second extending direction. An angle of the first included angle is between 10° and 80°. The first through holes penetrate through the flexible substrate. The first conductive structures are located in the first through holes and are electrically connected to the first signal lines and the first transmission lines.

公开(公告)号：US20200373333A1

公开(公告)日：2020-11-26

申请号：US16726846

申请日：2019-12-25

Applicant: Au Optronics Corporation

Inventor： Yu-Hsing Liang ,  Hsiu-Hua Wang ,  Chan-Jui Liu ,  Pin-Miao Liu ,  Chun-Cheng Cheng

IPC: H01L27/12

Abstract: An array substrate includes a substrate as well as a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer and a conductive structure sequentially formed thereon. The first insulating layer has a first opening communicated with a through hole of the substrate. The first conductive layer includes a first ring pattern extending from top of the first insulating layer into the first opening. The second insulating layer has a second opening communicated with the first opening. The second conductive layer includes a second ring pattern extending from top of the second insulating layer into the second opening. The first ring pattern laterally protrudes toward an axis of the through hole from the second ring pattern. The conductive structure extends from above the second insulating layer to a bottom surface of the substrate through the first and second openings and the through hole.

公开(公告)号：US11605652B2

公开(公告)日：2023-03-14

申请号：US16726846

申请日：2019-12-25

Applicant: Au Optronics Corporation

Inventor： Yu-Hsing Liang ,  Hsiu-Hua Wang ,  Chan-Jui Liu ,  Pin-Miao Liu ,  Chun-Cheng Cheng

IPC: H01L27/14 ,  H01L27/12

Abstract: An array substrate includes a substrate as well as a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer and a conductive structure sequentially formed thereon. The first insulating layer has a first opening communicated with a through hole of the substrate. The first conductive layer includes a first ring pattern extending from top of the first insulating layer into the first opening. The second insulating layer has a second opening communicated with the first opening. The second conductive layer includes a second ring pattern extending from top of the second insulating layer into the second opening. The first ring pattern laterally protrudes toward an axis of the through hole from the second ring pattern. The conductive structure extends from above the second insulating layer to a bottom surface of the substrate through the first and second openings and the through hole.

公开(公告)号：US11500433B2

公开(公告)日：2022-11-15

申请号：US17111482

申请日：2020-12-03

Applicant: Au Optronics Corporation

Inventor： Chan-Jui Liu ,  Chun-Cheng Cheng ,  Pin-Miao Liu

IPC: G06F1/18 ,  G09F9/30 ,  H01L27/32 ,  H01L27/15

Abstract: A flexible electronic device including a flexible substrate, a plurality of first signal lines, a plurality of first transmission lines, a plurality of first through holes, and a plurality of first conductive structures is provided. The flexible substrate has a first surface and a second surface opposite to the first surface. The first signal lines are located on the first surface and have a first extending direction. The first transmission lines are located on the second surface and have a second extending direction. A first included angle is provided between the first extending direction and the second extending direction. An angle of the first included angle is between 10° and 80°. The first through holes penetrate through the flexible substrate. The first conductive structures are located in the first through holes and are electrically connected to the first signal lines and the first transmission lines.

公开(公告)号：US11495646B2

公开(公告)日：2022-11-08

申请号：US16439722

申请日：2019-06-13

Applicant: Au Optronics Corporation

Inventor： Chan-Jui Liu ,  Chun-Cheng Cheng

IPC: H01L27/32 ,  G02F1/1333 ,  G02F1/1345

Abstract: A device substrate includes a carrier, a device array, first fan-out lines, and second fan-out lines. The carrier has a first side, a second side, a third side, and a fourth side. The first side is opposite to the second side. The third side is opposite to the fourth side. The device array is disposed on a first surface of the carrier. The device array includes sub-pixels. Each of the sub-pixels includes a switching element and an optoelectronic element electrically connected with the switching element. The first fan-out lines are extending from the first side to the first surface and electrically connected with the device array. The second fan-out lines are extending from the second side to the first surface and electrically connected with the device array. The first fan-out lines and the second fan-out lines are asymmetrically disposed on the first side and the second side, respectively.

公开(公告)号：US20200295107A1

公开(公告)日：2020-09-17

申请号：US16439722

申请日：2019-06-13

Applicant: Au Optronics Corporation

Inventor： Chan-Jui Liu ,  Chun-Cheng Cheng

IPC: H01L27/32

Abstract: A device substrate includes a carrier, a device array, first fan-out lines, and second fan-out lines. The carrier has a first side, a second side, a third side, and a fourth side. The first side is opposite to the second side. The third side is opposite to the fourth side. The device array is disposed on a first surface of the carrier. The device array includes sub-pixels. Each of the sub-pixels includes a switching element and an optoelectronic element electrically connected with the switching element. The first fan-out lines are extending from the first side to the first surface and electrically connected with the device array. The second fan-out lines are extending from the second side to the first surface and electrically connected with the device array. The first fan-out lines and the second fan-out lines are asymmetrically disposed on the first side and the second side, respectively.

公开(公告)号：US11476301B2

公开(公告)日：2022-10-18

申请号：US17105410

申请日：2020-11-25

Applicant: Au Optronics Corporation

Inventor： Chan-Jui Liu ,  Chen-Chi Lin ,  Chun-Cheng Cheng

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/00 ,  G09G3/00

Abstract: A display apparatus, including a substrate, a conductive structure, a pixel unit, a signal line, a transmission line, and a repair structure, is provided. The substrate has a first surface, a second surface, and a through hole. The conductive structure is disposed in the through hole. The pixel unit is disposed on the first surface. The pixel unit includes first, second, third, and fourth connection pads, a driving element, and a light-emitting element. The light-emitting element is electrically connected to the first and second connection pads. The signal line is disposed on the first surface. The driving element is electrically connected to the first and third connection pads through the signal line. The transmission line is disposed on the second surface and electrically connected to the second or fourth connection pad at least through the conductive structure. The repair structure is disposed between the transmission line and the conductive structure.

公开(公告)号：US11811013B2

公开(公告)日：2023-11-07

申请号：US17516708

申请日：2021-11-02

Applicant: Au Optronics Corporation

Inventor： Chun-Cheng Cheng ,  Chan-Jui Liu ,  Seok-Lyul Lee

IPC: H01L33/64 ,  H01L25/16 ,  H01L27/12

CPC classification number: H01L33/644 ,  H01L25/167 ,  H01L27/1248 ,  H01L33/641

Abstract: A display panel includes a drive element, a first heat dissipation layer, a light-emitting element, and a second heat dissipation layer. The drive element is disposed on a substrate. The first heat dissipation layer is disposed on the drive element. The light-emitting element is disposed on the first heat dissipation layer and electrically connected to the drive element. The second heat dissipation layer covers the light-emitting element. A refractive index of the first heat dissipation layer is greater than a refractive index of the second heat dissipation layer when a light-emitting surface of the light-emitting element faces the first heat dissipation layer, and the refractive index of the second heat dissipation layer is greater than the refractive index of the first heat dissipation layer when the light-emitting surface of the light-emitting element faces the second heat dissipation layer.