Invention Grant
- Patent Title: Data communication system
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Application No.: US16764142Application Date: 2018-11-14
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Publication No.: US11495899B2Publication Date: 2022-11-08
- Inventor: Eric Zbinden , Jignesh H. Shah
- Applicant: SAMTEC, INC.
- Applicant Address: US IN New Albany
- Assignee: SAMTEC, INC.
- Current Assignee: SAMTEC, INC.
- Current Assignee Address: US IN New Albany
- Agency: BakerHostetler
- International Application: PCT/US2018/060923 WO 20181114
- International Announcement: WO2019/099447 WO 20190523
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R12/72 ; H01R13/187

Abstract:
A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.
Public/Granted literature
- US20200280145A1 DATA COMMUNICATION SYSTEM Public/Granted day:2020-09-03
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