- Patent Title: Inductor built-in substrate and method for manufacturing the same
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Application No.: US16855108Application Date: 2020-04-22
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Publication No.: US11501909B2Publication Date: 2022-11-15
- Inventor: Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2019-081006 20190422
- Main IPC: H01L27/28
- IPC: H01L27/28 ; H01F27/28 ; H01L23/498 ; H01L23/552 ; H01F41/04 ; H01L21/48
Abstract:
An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.
Public/Granted literature
- US20200335259A1 INDUCTOR BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-10-22
Information query
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