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公开(公告)号：US20200335270A1
公开(公告)日：2020-10-22
申请号：US16850078
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki KODAMA , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.
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公开(公告)号：US20200335277A1
公开(公告)日：2020-10-22
申请号：US16850470
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01F41/04 , H01F27/28 , H01L21/48 , H01L49/02 , H01L23/498 , H01L23/552
Abstract: A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.
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公开(公告)号：US20200335258A1
公开(公告)日：2020-10-22
申请号：US16850109
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki KODAMA , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01F27/28 , H01L23/538 , H01L49/02 , H01L23/64 , H05K1/02
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.
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公开(公告)号：US11521786B2
公开(公告)日：2022-12-06
申请号：US16850109
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01F27/28 , H01L23/538 , H05K1/02 , H01L23/64 , H01L49/02 , H01L21/48 , H01L23/498
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.
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Patent Agency Ranking
公开(公告)号：US10818428B1
公开(公告)日：2020-10-27
申请号：US16850078
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.
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公开(公告)号：US11501909B2
公开(公告)日：2022-11-15
申请号：US16855108
申请日：2020-04-22
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01L27/28 , H01F27/28 , H01L23/498 , H01L23/552 , H01F41/04 , H01L21/48
Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.
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公开(公告)号：US11749444B2
公开(公告)日：2023-09-05
申请号：US16847748
申请日：2020-04-14
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
CPC classification number: H01F27/2804 , H01F27/324 , H01F41/041
Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.
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公开(公告)号：US11322301B2
公开(公告)日：2022-05-03
申请号：US16850470
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01F41/04 , H01F27/28 , H01L21/48 , H01L23/498 , H01L23/552 , H01L49/02 , H05K3/42
Abstract: A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.
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公开(公告)号：US20170303394A1
公开(公告)日：2017-10-19
申请号：US15487652
申请日：2017-04-14
Applicant: IBIDEN CO., LTD.
Inventor： Hiroyuki NISHIOKA , Katsuya Takagi , Hiroaki Uno , Satoru Katada
CPC classification number: H05K1/09 , B32B7/02 , B32B15/20 , B32B37/14 , B32B37/144 , B32B2307/202 , B32B2307/206 , B32B2307/538 , B32B2309/105 , B32B2311/12 , B32B2457/08 , H05K1/032 , H05K3/3452 , H05K3/38 , H05K3/4644
Abstract: A printed wiring board includes a laminated base material including a surface conductor layer, a conductor layer, an interlayer insulating layer interposed between the surface conductor layer and the conductor layer, and an internal bonding layer interposed between the interlayer insulating layer and the surface conductor layer and/or conductor layer, and a solder resist layer laminated on a surface of the laminated base material such that the solder resist layer is covering the surface conductor layer. The internal bonding layer has a surface in contact with the interlayer insulating layer such that the surface of the internal bonding layer has arithmetic average roughness Ra in a range of 100 nm or more and 300 nm or less, and the surface conductor layer has a surface on a solder resist layer side such that the surface of the surface conductor layer has arithmetic average roughness Ra of less than 100 nm.
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