-
公开(公告)号：US11501909B2
公开(公告)日：2022-11-15
申请号：US16855108
申请日：2020-04-22
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01L27/28 , H01F27/28 , H01L23/498 , H01L23/552 , H01F41/04 , H01L21/48
Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.
-
公开(公告)号：US11521786B2
公开(公告)日：2022-12-06
申请号：US16850109
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01F27/28 , H01L23/538 , H05K1/02 , H01L23/64 , H01L49/02 , H01L21/48 , H01L23/498
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.
-
公开(公告)号：US10818428B1
公开(公告)日：2020-10-27
申请号：US16850078
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.
-
公开(公告)号：US20200335277A1
公开(公告)日：2020-10-22
申请号：US16850470
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01F41/04 , H01F27/28 , H01L21/48 , H01L49/02 , H01L23/498 , H01L23/552
Abstract: A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.
-
公开(公告)号：US20200335258A1
公开(公告)日：2020-10-22
申请号：US16850109
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki KODAMA , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
IPC: H01F27/28 , H01L23/538 , H01L49/02 , H01L23/64 , H05K1/02
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.
-
Patent Agency Ranking
公开(公告)号：US12033927B2
公开(公告)日：2024-07-09
申请号：US17361522
申请日：2021-06-29
Applicant: IBIDEN CO., LTD.
Inventor： Isao Ohno , Tomoya Daizo , Yoji Sawada , Kazuhiko Kuranobu
IPC: H01L21/48 , H01L23/498
CPC classification number: H01L23/49822 , H01L21/4857
Abstract: A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.
-
公开(公告)号：US11935822B2
公开(公告)日：2024-03-19
申请号：US17359887
申请日：2021-06-28
Applicant: IBIDEN CO., LTD.
Inventor： Isao Ohno , Tomoya Daizo , Yoji Sawada , Kazuhiko Kuranobu
IPC: H01L23/498 , H01L21/48 , H01L23/00
CPC classification number: H01L23/49838 , H01L21/4857 , H01L23/49822 , H01L24/10 , H01L24/12 , H01L24/13 , H01L24/14
Abstract: A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.
-
公开(公告)号：US20200335270A1
公开(公告)日：2020-10-22
申请号：US16850078
申请日：2020-04-16
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki KODAMA , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.
-
公开(公告)号：US11749444B2
公开(公告)日：2023-09-05
申请号：US16847748
申请日：2020-04-14
Applicant: IBIDEN CO., LTD.
Inventor： Hiroaki Kodama , Kazuro Nishiwaki , Kazuhiko Kuranobu , Hiroaki Uno
CPC classification number: H01F27/2804 , H01F27/324 , H01F41/041
Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.
-
公开(公告)号：US11622446B2
公开(公告)日：2023-04-04
申请号：US17359805
申请日：2021-06-28
Applicant: IBIDEN CO., LTD.
Inventor： Isao Ohno , Tomoya Daizo , Yoji Sawada , Kazuhiko Kuranobu
IPC: H05K1/11 , H05K1/09 , H01L23/00 , H01L23/498
Abstract: A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.027 seconds)
