Invention Grant
- Patent Title: Array substrate and display device with interposer bonded to drive circuit and manufacturing method thereof
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Application No.: US16761823Application Date: 2019-03-26
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Publication No.: US11502153B2Publication Date: 2022-11-15
- Inventor: Renquan Gu , Qi Yao , Jaiil Ryu , Zhiwei Liang , Yingwei Liu , Wusheng Li , Muxin Di
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Fay Sharpe LLP
- International Application: PCT/CN2019/079644 WO 20190326
- International Announcement: WO2020/191607 WO 20201001
- Main IPC: H01L27/32
- IPC: H01L27/32
Abstract:
An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.
Public/Granted literature
- US20210217837A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-07-15
Information query
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