公开(公告)号：US12133416B2

公开(公告)日：2024-10-29

申请号：US17763871

申请日：2021-05-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Can Wang ,  Qiuyu Ling ,  Renquan Gu ,  Jingkai Ni ,  Yongfa Dong

IPC: H10K59/38 ,  F21V8/00 ,  G02B3/00 ,  H10K50/858 ,  H10K59/35 ,  H10K71/00 ,  G02B27/01

CPC classification number: H10K50/858 ,  G02B3/0056 ,  G02B6/0016 ,  G02B6/003 ,  G02B6/0035 ,  H10K59/352 ,  H10K71/00 ,  G02B27/0101 ,  G02B2027/0112 ,  H10K59/38

Abstract: Embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device. The display panel includes a substrate, and a plurality of pixel units on the substrate. The pixel units are arranged in an array, and two adjacent columns of pixel units are spaced apart from each other to form an interval area. Each pixel unit includes a pixel defining layer and sub-pixels, and the sub-pixels are in pixel areas defined by the pixel defining layer. Cathodes of all sub-pixels in one column of pixel units are connected as one single piece.

公开(公告)号：US12089449B2

公开(公告)日：2024-09-10

申请号：US17424747

申请日：2020-09-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Haitao Huang ,  Chuanxiang Xu ,  Shi Shu ,  Yong Yu ,  Renquan Gu

IPC: H10K59/122 ,  H10K50/86 ,  H10K59/121 ,  H10K59/38

CPC classification number: H10K59/122 ,  H10K50/865 ,  H10K59/1213 ,  H10K59/38

Abstract: A display panel includes: a base; a pixel defining layer disposed on a side of the base; a plurality of light-emitting devices disposed on a side of the base; and at least one connection portion disposed on a side of the pixel defining layer away from the base. The pixel defining layer has a plurality of first openings. At least a portion of each light-emitting device is located in a first opening. An orthogonal projection of a connection portion on the base is located within an orthogonal projection of the pixel defining layer on the base. A surface of the connection portion away from the base has a plurality of protrusions, and the connection portion is configured to diffusely reflect external ambient light incident into the display panel.

公开(公告)号：US20240088170A1

公开(公告)日：2024-03-14

申请号：US18518526

申请日：2023-11-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/1251 ,  H01L27/127

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US11885978B2

公开(公告)日：2024-01-30

申请号：US17348677

申请日：2021-06-15

Applicant: BOE Technology Group Co., Ltd.

Inventor： Feng Zhang ,  Kang Guo ,  Renquan Gu ,  Detian Meng ,  Libo Wang ,  Dongfei Hou ,  Guangcai Yuan ,  Xue Dong ,  Wei Wang ,  Jinye Zhu ,  Jing Yu ,  Jing Liu ,  Haitao Huang

IPC: G02B3/00 ,  B29D11/00 ,  G02B27/09 ,  G02B27/01

CPC classification number: G02B3/0043 ,  B29D11/00298 ,  G02B3/0056 ,  G02B27/0172 ,  G02B27/0961

Abstract: Disclosed are a micro-lens structure, a displaying device, and a machining method of the micro-lens structure. The micro-lens structure specifically comprises: micro-lens units distributed in an array, wherein each micro-lens unit comprises at least two micro-lenses made of a photoresist, and the at least two micro-lenses have different arch heights.

公开(公告)号：US20240036386A1

公开(公告)日：2024-02-01

申请号：US18461652

申请日：2023-09-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haitao Huang ,  Shi Shu ,  Chuanxiang Xu ,  Liuqing Li ,  Zhao Cui ,  Renquan Gu

IPC: G02F1/1335 ,  G02F1/1343 ,  C23C16/26 ,  C23C16/50 ,  G02F1/1368 ,  G03F7/00 ,  H10K59/122 ,  H10K71/00

CPC classification number: G02F1/133519 ,  G02F1/133548 ,  G02F1/134345 ,  C23C16/26 ,  C23C16/50 ,  G02F1/133514 ,  G02F1/1368 ,  G03F7/0007 ,  H10K59/122 ,  H10K71/00 ,  G02F1/133357

Abstract: A display panel is provided. The display panel includes a base substrate; a bank layer on the base substrate, the bank layer defining a plurality of bank apertures; a quantum dots material layer on the base substrate, the quantum dots material layer comprising a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures; a barrier coating layer in a respective one of the plurality of bank apertures; and an encapsulating layer on a side of the barrier coating layer closer to the base substrate. At least a portion of the barrier coating layer is in direct contact with a portion of the encapsulating layer.

公开(公告)号：US11782304B2

公开(公告)日：2023-10-10

申请号：US17419685

申请日：2020-09-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haitao Huang ,  Shi Shu ,  Chuanxiang Xu ,  Liuqing Li ,  Zhao Cui ,  Renquan Gu

IPC: G02F1/1335 ,  G02F1/1343 ,  G02F1/1368 ,  G03F7/00 ,  H10K59/122 ,  G02F1/1333 ,  H10K59/12 ,  C23C16/26 ,  C23C16/50 ,  H10K71/00 ,  H10K102/00

CPC classification number: G02F1/133519 ,  C23C16/26 ,  C23C16/50 ,  G02F1/1368 ,  G02F1/133514 ,  G02F1/133548 ,  G02F1/134345 ,  G03F7/0007 ,  H10K59/122 ,  H10K71/00 ,  G02F1/133357 ,  G02F2202/36 ,  H10K59/1201 ,  H10K2102/331

Abstract: A display panel is provided. The display panel includes a bank layer and a quantum dots material layer on a base substrate. The bank layer defines a plurality of bank apertures. The quantum dots material layer includes a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures. At least a portion of the bank layer between two adjacent bank apertures includes a first surface, a second surface opposite to the first surface, a third surface connecting the first surface and the second surface closer to a first bank aperture, and a fourth surface connecting the first surface and the second surface closer to a second bank aperture. At least a portion of a third surface or a fourth surface of a portion of the bank layer between two adjacent bank apertures is a wavy surface including alternating convex and concave portions.

公开(公告)号：US11502153B2

公开(公告)日：2022-11-15

申请号：US16761823

申请日：2019-03-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.

公开(公告)号：US11309528B2

公开(公告)日：2022-04-19

申请号：US16769374

申请日：2019-10-08

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei He ,  Huili Wu ,  Shipei Li ,  Dongsheng Li ,  Fang He ,  Renquan Gu ,  Sheng Xu ,  Dongsheng Yin ,  Wusheng Li ,  Qi Yao

IPC: H01L51/56 ,  H01L51/00 ,  H01L27/32

Abstract: The present disclosure relates to a method of fabricating a flexible display panel. The method of fabricating the flexible display panel may include forming a photosensitive layer comprising at least one azo group on a carrier substrate; forming a flexible substrate on the photosensitive layer; irradiating the photosensitive layer with ultraviolet light; and peeling off the flexible substrate from the carrier substrate.

公开(公告)号：US20200273786A1

公开(公告)日：2020-08-27

申请号：US16530605

申请日：2019-08-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Muxin Di ,  Zhiwei Liang ,  Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao ,  Renquan Gu ,  Qi Yao ,  Jaiil Ryu

IPC: H01L23/498 ,  H01L21/48

Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.

公开(公告)号：US12191430B2

公开(公告)日：2025-01-07

申请号：US18043203

申请日：2022-03-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shipei Li ,  Wusheng Li ,  Ying Zhao ,  Huili Wu ,  Sheng Xu ,  Wei He ,  Renquan Gu ,  Wenqing Xue ,  Jianjun Zhao ,  Qi Yao

IPC: H01L33/58 ,  G02F1/1335 ,  G02F1/13357 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting substrate includes a transparent substrate; a first metal light-shielding layer, a wiring layer and light-emitting devices. The first metal light-shielding layer is disposed on the transparent substrate. The wiring layer is disposed on a side of the first metal light-shielding layer away from the transparent substrate, and the wiring layer includes circuit traces and pads. Orthographic projections of the circuit traces and the pads on the transparent substrate are all located within an orthographic projection of the first metal light-shielding layer on the transparent substrate. The light-emitting devices are disposed on a side of the wiring layer away from the transparent substrate, and electrically connected to some of the pads; and orthographic projections of the light-emitting devices on the transparent substrate are located within the orthographic projection of the first metal light-shielding layer on the transparent substrate.