Invention Grant
- Patent Title: Extreme high throughput physical layer data rate
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Application No.: US17151729Application Date: 2021-01-19
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Publication No.: US11503605B2Publication Date: 2022-11-15
- Inventor: Po-Kai Huang , Daniel F. Bravo , Robert J. Stacey , Laurent Cariou , Arik Klein
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04W72/04
- IPC: H04W72/04 ; H04L47/36 ; H04W28/20 ; H04W28/02 ; H04L69/18

Abstract:
Methods, apparatuses, and computer readable media for extreme high throughput (EHT) physical layer data rate. An apparatus of an access point (AP) comprising processing circuitry configured to encode an EHT capabilities element, the EHT capabilities element comprising a maximum media access control (MAC) protocol data unit (MPDU) in an aggregated MPDU (A-MPDU) length exponent subfield. The processing circuitry further configured to configure the AP to transmit the EHT capabilities element to a station (STA), and determine a maximum A-MPDU length based on two raised to a power of a constant plus a value of the A-MPDU length exponent subfield. The processing circuitry further configured to encode MPDUs in an A-MPDU, where the A-MPDU is encoded to be less than or equal to the maximum A-MPDU length.
Public/Granted literature
- US20210195578A1 EXTREME HIGH THROUGHPUT PHYSICAL LAYER DATA RATE Public/Granted day:2021-06-24
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