The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer.