TEST SOCKET AND TEST APPARATUS HAVING THE SAME

    公开(公告)号:US20220099730A1

    公开(公告)日:2022-03-31

    申请号:US17468341

    申请日:2021-09-07

    Applicant: TSE CO., LTD.

    Inventor: Chang Su Oh

    Abstract: The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer.

    ELECTROCONDUCTIVE PARTICLES AND SIGNAL-TRANSMITTING CONNECTOR HAVING SAME

    公开(公告)号:US20220005626A1

    公开(公告)日:2022-01-06

    申请号:US17289023

    申请日:2019-10-23

    Applicant: TSE CO., LTD.

    Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

    Test socket and test apparatus having the same

    公开(公告)号:US11506705B2

    公开(公告)日:2022-11-22

    申请号:US17468341

    申请日:2021-09-07

    Applicant: TSE CO., LTD.

    Inventor: Chang Su Oh

    Abstract: The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer.

    TEST SOCKET AND TEST APPARATUS HAVING THE SAME

    公开(公告)号:US20220057433A1

    公开(公告)日:2022-02-24

    申请号:US17403348

    申请日:2021-08-16

    Applicant: TSE CO., LTD.

    Inventor: Chang Su Oh

    Abstract: The present disclosure discloses a test socket including an inelastic insulating housing formed of an inelastic insulating material having a plurality of housing holes, and a plurality of electro-conductive parts comprising electro-conductive particles in an elastic insulating material, the electro-conductive parts including an electro-conductive part body having a lower end portion to be connected to a signal electrode of the tester, an upper end portion to be connected to the terminal of the device under inspection, and an electro-conductive part bump connected to the electro-conductive part body to protrude from one or both of an upper and lower surface of the inelastic insulating housing.

    TEST SOCKET AND TEST APPARATUS HAVING THE SAME, MANUFACTURING METHOD FOR THE TEST SOCKET

    公开(公告)号:US20210293880A1

    公开(公告)日:2021-09-23

    申请号:US17204186

    申请日:2021-03-17

    Applicant: TSE CO., LTD.

    Abstract: The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.

    TEST SOCKET AND TEST APPARATUS HAVING THE SAME, MANUFACTURING METHOD FOR THE TEST SOCKET

    公开(公告)号:US20210302494A1

    公开(公告)日:2021-09-30

    申请号:US17209444

    申请日:2021-03-23

    Applicant: TSE CO., LTD.

    Inventor: Chang Su Oh

    Abstract: A test socket according to the present disclosure is provided in a test apparatus in which a device under inspection having a terminal is connected to a tester, which generates a test signal, for testing the device under inspection, the test socket includes a nonelastic insulating housing formed of a nonelastic insulating material and provided with a plurality of housing holes formed therein to pass therethrough in a thickness direction; and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, the electrically-conductive part having a lower end portion connected to a signal electrode of the tester placed below the nonelastic insulating housing and an upper end portion disposed in the housing hole to be connected to the terminal of the device under inspection placed on the nonelastic insulating housing.

    TEST APPARATUS FOR SEMICONDUCTOR PACKAGE

    公开(公告)号:US20210302468A1

    公开(公告)日:2021-09-30

    申请号:US17210970

    申请日:2021-03-24

    Applicant: TSE CO., LTD.

    Abstract: The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.

    Test socket and test apparatus having the same, manufacturing method for the test socket

    公开(公告)号:US11131707B1

    公开(公告)日:2021-09-28

    申请号:US17209444

    申请日:2021-03-23

    Applicant: TSE CO., LTD.

    Inventor: Chang Su Oh

    Abstract: A test socket according to the present disclosure is provided in a test apparatus in which a device under inspection having a terminal is connected to a tester, which generates a test signal, for testing the device under inspection, the test socket includes a nonelastic insulating housing formed of a nonelastic insulating material and provided with a plurality of housing holes formed therein to pass therethrough in a thickness direction; and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, the electrically-conductive part having a lower end portion connected to a signal electrode of the tester placed below the nonelastic insulating housing and an upper end portion disposed in the housing hole to be connected to the terminal of the device under inspection placed on the nonelastic insulating housing.

    Test apparatus for semiconductor package

    公开(公告)号:US11609244B2

    公开(公告)日:2023-03-21

    申请号:US17210970

    申请日:2021-03-24

    Applicant: TSE CO., LTD.

    Abstract: The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.

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