Invention Grant
- Patent Title: Deposition of flowable silicon-containing films
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Application No.: US15654185Application Date: 2017-07-19
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Publication No.: US11515149B2Publication Date: 2022-11-29
- Inventor: Lakmal C. Kalutarage , Mark Saly , David Thompson , Abhijit Basu Mallick , Tejasvi Ashok , Pramit Manna
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/22
- IPC: C23C16/22 ; H01L21/02 ; H01L21/762
Abstract:
Methods for seam-less gapfill comprising forming a flowable film by exposing a substrate surface to a silicon-containing precursor and a co-reactant are described. The silicon-containing precursor has at least one akenyl or alkynyl group. The flowable film can be cured by any suitable curing process to form a seam-less gapfill.
Public/Granted literature
- US20180025907A1 Deposition Of Flowable Silicon-Containing Films Public/Granted day:2018-01-25
Information query
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