Invention Grant
- Patent Title: Layout of wordline and method of forming the same
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Application No.: US17345391Application Date: 2021-06-11
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Publication No.: US11515252B2Publication Date: 2022-11-29
- Inventor: Tsung-Wei Lin , Chun-Yen Liao , Chun-Sheng Wu
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW109143020 20201207
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/528 ; H01L21/768

Abstract:
A word line layout includes a substrate, a first word line group, a second word line group, and an I-shaped third word line. The first word line group is disposed on the substrate and includes a plurality of L-shaped first word lines, and each of the first word lines has a first segment and a second segment connected to each other. The second word line group is disposed on the substrate and includes a plurality of L-shaped second word lines, and each of the second word lines has a first segment and a second segment connected to each other. The first word line group and the second word line group are arranged in juxtaposition and symmetric to each other. The I-shaped third word line is disposed on the outer side of the first word line group and the second word line group.
Public/Granted literature
- US20220181249A1 LAYOUT OF WORDLINE AND METHOD OF FORMING THE SAME Public/Granted day:2022-06-09
Information query
IPC分类: