- Patent Title: Precise bottom junction formation for vertical transport field effect transistor with highly doped epitaxial source/drain, sharp junction gradient, and/or reduced parasitic capacitance
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Application No.: US16901852Application Date: 2020-06-15
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Publication No.: US11515427B2Publication Date: 2022-11-29
- Inventor: Kai Zhao , Shahab Siddiqui , Daniel James Dechene , Rishikesh Krishnan , Charlotte DeWan Adams
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt & Kammer PLLC
- Agent James Olsen
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/786 ; H01L29/423 ; H01L29/66 ; H01L21/8234 ; H01L29/08

Abstract:
Epitaxially grow first lower source-drain regions within a substrate. Portions of the substrate adjacent the lower regions are doped to form second lower source-drain regions. An undoped silicon layer is formed over the first and second lower regions. Etch completely through the undoped layer into the first and second lower regions to form fins and to define bottom junctions beneath the fins. The fins and bottom junctions define intermediate cavities. Form lower spacers, gates, and upper spacers in the cavities; form top junctions on outer surfaces of the fins; and form epitaxially grown first upper source-drain regions outward of the upper spacers and opposite the first lower regions. The first upper regions are doped the same as the first lower regions. Form second upper source-drain regions outward of the upper spacers and opposite the second lower regions; these are doped the same as the second lower regions.
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