Invention Grant
- Patent Title: Electronic device using interposer in printed circuit board
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Application No.: US17172351Application Date: 2021-02-10
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Publication No.: US11516917B2Publication Date: 2022-11-29
- Inventor: Junghoon Park , Younggirl Yun , Sunggeun Kang , Myungsub Ko , Jaeyeon Ra , Seungbo Shim , Yongjin Woo , Junhee Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2020-0015924 20200210
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K1/02

Abstract:
An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
Public/Granted literature
- US20210251079A1 ELECTRONIC DEVICE USING INTERPOSER IN PRINTED CIRCUIT BOARD Public/Granted day:2021-08-12
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