公开(公告)号：US12126122B2

公开(公告)日：2024-10-22

申请号：US17569889

申请日：2022-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juho Yi ,  Sunggeun Kang ,  Waneui Jung ,  Heejin Lee

IPC: H01R13/6594 ,  G06F1/16 ,  G06F1/18 ,  H04M1/02 ,  H01R12/72 ,  H01R13/52 ,  H01R13/6581 ,  H01R13/6591 ,  H01R24/60 ,  H01R107/00 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01R13/6594 ,  G06F1/1658 ,  G06F1/185 ,  H04M1/0274 ,  H04M1/0277 ,  G06F1/1684 ,  H01R12/722 ,  H01R12/727 ,  H01R13/5202 ,  H01R13/6581 ,  H01R13/6591 ,  H01R24/60 ,  H01R2107/00 ,  H01R2201/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K1/184 ,  H05K1/189 ,  H05K3/301 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10393 ,  H05K2201/10409

Abstract: An electronic device is provided, which includes a printed circuit board (PCB) including a first surface and a second surface facing in a direction opposite to the first surface; and an interface terminal positioned at least partially on the first surface of the PCB, The interface terminal includes a shell including a hollow portion extending from a first opening on a first side of the shell to a second opening on a second side of the shell, a terminal structure including a non-conductive plate positioned in the hollow portion and a plurality of terminals positioned on the non-conductive plate, a first bracket that at least partially covers a surface of the shell, and a second bracket that at least partially covers another surface of the shell. The second bracket includes a protrusion protruding with respect to the second surface of the PCB.

公开(公告)号：US11516917B2

公开(公告)日：2022-11-29

申请号：US17172351

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon Park ,  Younggirl Yun ,  Sunggeun Kang ,  Myungsub Ko ,  Jaeyeon Ra ,  Seungbo Shim ,  Yongjin Woo ,  Junhee Han

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.

公开(公告)号：US20210251079A1

公开(公告)日：2021-08-12

申请号：US17172351

申请日：2021-02-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon PARK ,  Younggirl Yun ,  Sunggeun Kang ,  Myungsub Ko ,  Jaeyeon Ra ,  Seungbo Shim ,  Yongjin Woo ,  Junhee Han

IPC: H05K1/14 ,  H05K1/02

Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.