Electronic device including stacked printed circuit boards

    公开(公告)号:US12156326B2

    公开(公告)日:2024-11-26

    申请号:US17833184

    申请日:2022-06-06

    Abstract: An electronic device includes: a first printed circuit board (PCB) including a first plate and a first hole formed in the first plate, a second PCB including a second plate, an interposer including a third plate positioned between the first plate and the second plate, a plurality of first vias connecting the first plate and the third plate, a plurality of second vias connecting the second plate and the third plate, and a first reinforcement portion positioned in the first hole to bond the first plate and the third plate.

    Electronic device comprising plurality of light sources

    公开(公告)号:US11191440B2

    公开(公告)日:2021-12-07

    申请号:US16359189

    申请日:2019-03-20

    Abstract: An electronic device includes a light emitter emitting visible light, an infrared emitter emitting infrared light, at least one detector detecting an electromagnetic wave, and at least one processor configured to obtain a user input to obtain spectral data of a target object, in response to obtaining the user input, emit the visible light by using the light emitter and emit the infrared light by using the infrared emitter, obtain a first reflected signal of the visible light reflected by the target object and a second reflected signal of the infrared light reflected by the target object, using the at least one detector, and generate the spectral data of the target object based on the first reflected signal and the second reflected signal.

    Semiconductor device having interconnection structure

    公开(公告)号:US10566233B2

    公开(公告)日:2020-02-18

    申请号:US16534195

    申请日:2019-08-07

    Abstract: A semiconductor device includes a semiconductor pattern on a semiconductor substrate, a three-dimensional memory array on the semiconductor pattern, and a peripheral interconnection structure between the semiconductor pattern and the semiconductor substrate. The peripheral interconnection structure includes an upper interconnection structure on a lower interconnection structure. The upper interconnection structure includes an upper interconnection and an upper barrier layer. The lower interconnection structure includes a lower interconnection and a lower barrier layer. The upper barrier layer is under a bottom surface of the upper interconnection and does not cover side surfaces of the upper interconnection. The lower barrier layer is under a bottom surface of the lower interconnection and covers side surfaces of the lower interconnection.

    Nonvolatile memory and erasing method thereof
    9.
    发明授权
    Nonvolatile memory and erasing method thereof 有权
    非易失性存储器及其擦除方法

    公开(公告)号:US09552884B2

    公开(公告)日:2017-01-24

    申请号:US15238740

    申请日:2016-08-17

    Abstract: An erase method of a nonvolatile memory includes supplying an erase voltage to a substrate, supplying a selection word line voltage to word lines connected with a selected sub-block within a memory block of the nonvolatile memory, supplying a non-selection word line voltage to word lines connected with an unselected sub-block within the memory block during a first delay time from a point of time when the erase voltage is supplied, and thereafter floating the word lines connected with the unselected sub-block.

    Abstract translation: 非易失性存储器的擦除方法包括向衬底提供擦除电压,将选择字线电压提供给与非易失性存储器的存储块内的选定子块相连的字线,将非选择字线电压提供给 在从提供擦除电压的时间点起的第一延迟时间期间,与存储器块内的未选择子块相连的字线,然后浮动与未选择的子块相连的字线。

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