Invention Grant
- Patent Title: Reduced footprint platform architecture with linear vacuum transfer module
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Application No.: US16493145Application Date: 2018-03-14
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Publication No.: US11521869B2Publication Date: 2022-12-06
- Inventor: Richard H. Gould , Richard Blank
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- International Application: PCT/US2018/022397 WO 20180314
- International Announcement: WO2018/170104 WO 20180920
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677

Abstract:
An atmosphere-to-vacuum (ATV) transfer module for a substrate processing tool includes a first side configured to interface with at least one loading station, a transfer robot assembly arranged within the ATV transfer module, and a second side opposite the first side. The transfer robot assembly is configured to transfer substrates between the at least one loading station and at least one load lock arranged between the ATV transfer module and a vacuum transfer module (VTM). The second side is configured to interface with the at least one load lock. The transfer robot assembly is arranged adjacent to the second side, and the at least one load lock extends through the second side into an interior volume of the ATV transfer module.
Public/Granted literature
- US20200083071A1 REDUCED FOOTPRINT PLATFORM ARCHITECTURE WITH LINEAR VACUUM TRANSFER MODULE Public/Granted day:2020-03-12
Information query
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