公开(公告)号：US12168301B2

公开(公告)日：2024-12-17

申请号：US17435020

申请日：2020-02-27

Applicant: LAM RESEARCH CORPORATION

Inventor： Richard Blank ,  Aravind Alwan ,  Behnam Behziz ,  Peter Thaulad ,  Mark E. Emerson

IPC: B25J11/00 ,  B25J9/16 ,  B25J21/00

Abstract: A robot calibration system includes a calibration fixture configured to be mounted on a substrate processing chamber. The calibration fixture includes at least one camera arranged to capture an image including an outer edge of a test substrate and an edge ring surrounding the test substrate. A controller is configured to receive the captured image, analyze the captured image to measure a distance between the outer edge of the test substrate and the edge ring, calculate a center of the test substrate based on the measured distance, and calibrate a robot configured to transfer substrate to and from the substrate processing chamber based on the calculated center of the test substrate.

公开(公告)号：US09190306B2

公开(公告)日：2015-11-17

申请号：US14092240

申请日：2013-11-27

Applicant: Lam Research Corporation

Inventor： Richard Blank ,  Matt McLellan

IPC: H01L21/67 ,  H01L21/677 ,  B25J11/00 ,  B25J9/04

CPC classification number: H01L21/67742 ,  B25J9/042 ,  B25J9/043 ,  B25J11/0095 ,  H01L21/67748 ,  Y10S901/27

Abstract: A dual arm robot for a substrate processing system includes a base and a first arm having extended and retracted positions. Each of the first and second arms includes a first arm portion having one end rotatably connected to the base, a second arm portion having one end rotatably connected to another end of the first arm portion, and an end effector having one end rotatably connected to another end of the second arm portion and another end configured to support first and second substrates, respectively. When the first and second arms are arranged in the retracted position, connections between the second arm portions and the end effectors are located over or under the second and first substrates, respectively, and the first substrate is not located over or under the second substrate.

Abstract translation: 用于基板处理系统的双臂机器人包括基座和具有延伸和缩回位置的第一臂。 第一臂和第二臂中的每一个包括具有可旋转地连接到基座的一端的第一臂部分，具有可旋转地连接到第一臂部分的另一端的一端的第二臂部分和具有可旋转地连接到另一端的端部的端部执行器 第二臂部分的端部和分别支撑第一和第二基板的另一端。 当第一和第二臂布置在缩回位置时，第二臂部分和端部执行器之间的连接分别位于第二和第一基板的上方或下方，并且第一基板不位于第二基板的上方或下方。

公开(公告)号：US11239100B2

公开(公告)日：2022-02-01

申请号：US16870847

申请日：2020-05-08

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US10651065B2

公开(公告)日：2020-05-12

申请号：US16000734

申请日：2018-06-05

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US20240194505A1

公开(公告)日：2024-06-13

申请号：US18581084

申请日：2024-02-19

Applicant: LAM RESEARCH CORPORATION

Inventor： Richard H. Gould ,  Richard Blank

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67201 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/67178 ,  Y10S414/139

Abstract: A transfer robot assembly arranged within an ATV transfer module includes a transfer robot that includes an end effector and one or more arm segments connected between the end effector and a transfer robot platform. A first robot alignment arm is connected to the transfer robot platform. A second robot alignment arm is connected to the first robot alignment arm and to a mounting chassis of the ATV transfer module. The transfer robot assembly is configured to actuate the first robot alignment arm and the second robot alignment arm to raise and lower the transfer robot to adjust a position of the transfer robot in a vertical direction and in a horizontal direction. The transfer robot is configured to fold into a folded configuration having a narrow profile occupying less than 50% of an overall depth of the ATV transfer module.

公开(公告)号：US20230395410A1

公开(公告)日：2023-12-07

申请号：US18448871

申请日：2023-08-11

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66

CPC classification number: H01L21/67259 ,  H01L21/67201 ,  H01L21/68764 ,  H01L21/68 ,  H01L21/67742 ,  H01L21/67161 ,  H01J37/32724 ,  H01L22/20 ,  H01L21/67248 ,  H01L21/68742 ,  H01L21/68771 ,  H01L21/67748 ,  H01L21/67253 ,  H01L21/681 ,  H01J2237/334 ,  H01L21/6831

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US20220108902A1

公开(公告)日：2022-04-07

申请号：US17553658

申请日：2021-12-16

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US09576833B2

公开(公告)日：2017-02-21

申请号：US14876951

申请日：2015-10-07

Applicant: LAM RESEARCH CORPORATION

Inventor： Richard Blank ,  Matt McLellan

IPC: H01L21/677 ,  B25J11/00 ,  B25J9/04

CPC classification number: H01L21/67742 ,  B25J9/042 ,  B25J9/043 ,  B25J11/0095 ,  H01L21/67748 ,  Y10S901/27

Abstract: A robot for a substrate processing system includes a first arm and a second arm each including a first arm portion connected to a base, a second arm portion connected to the first arm portion, and an end effector connected to the second arm portion. The first arm and the second arm are each configured to actuate between a fully retracted position and a plurality of extended positions. The end effector of the first arm is configured to support a first substrate and the end effector of the second arm is configured to support a second substrate. When the first arm and the second arm are in the respective fully retracted positions, the first substrate is spaced apart from and does not overlap the second substrate.

Abstract translation: 一种用于基板处理系统的机器人，包括第一臂和第二臂，每个臂包括连接到基座的第一臂部分，连接到第一臂部分的第二臂部分和连接到第二臂部分的末端执行器。 第一臂和第二臂各自构造成在完全缩回位置和多个延伸位置之间致动。 第一臂的末端执行器被配置为支撑第一基板，并且第二臂的端部执行器被配置为支撑第二基板。 当第一臂和第二臂处于相应的完全缩回位置时，第一衬底与第二衬底间隔开并且不与第二衬底重叠。

公开(公告)号：US11742229B2

公开(公告)日：2023-08-29

申请号：US17553658

申请日：2021-12-16

Applicant: Lam Research Corporation

Inventor： Jacob L. Hiester ,  Richard Blank ,  Peter Thaulad ,  Paul Konkola

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/68 ,  H01L21/677 ,  H01J37/32 ,  H01L21/66 ,  H01L21/683

CPC classification number: H01L21/67259 ,  H01J37/32724 ,  H01L21/67161 ,  H01L21/67201 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68 ,  H01L21/681 ,  H01L21/68742 ,  H01L21/68764 ,  H01L21/68771 ,  H01L22/20 ,  H01J2237/2446 ,  H01J2237/24578 ,  H01J2237/334 ,  H01J2237/3321 ,  H01L21/6831

Abstract: A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.

公开(公告)号：US11521869B2

公开(公告)日：2022-12-06

申请号：US16493145

申请日：2018-03-14

Applicant: LAM RESEARCH CORPORATION

Inventor： Richard H. Gould ,  Richard Blank

IPC: H01L21/67 ,  H01L21/677

Abstract: An atmosphere-to-vacuum (ATV) transfer module for a substrate processing tool includes a first side configured to interface with at least one loading station, a transfer robot assembly arranged within the ATV transfer module, and a second side opposite the first side. The transfer robot assembly is configured to transfer substrates between the at least one loading station and at least one load lock arranged between the ATV transfer module and a vacuum transfer module (VTM). The second side is configured to interface with the at least one load lock. The transfer robot assembly is arranged adjacent to the second side, and the at least one load lock extends through the second side into an interior volume of the ATV transfer module.