Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having vertically discrete source or drain structures
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Application No.: US16146778Application Date: 2018-09-28
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Publication No.: US11527612B2Publication Date: 2022-12-13
- Inventor: Glenn Glass , Anand Murthy , Biswajeet Guha , Dax M. Crum , Sean Ma , Tahir Ghani , Susmita Ghose , Stephen Cea , Rishabh Mehandru
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/285 ; H01L21/306 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/417 ; H01L29/423 ; H01L29/45 ; H01L29/66 ; H01L29/78 ; H01L21/683

Abstract:
Gate-all-around integrated circuit structures having vertically discrete source or drain structures, and methods of fabricating gate-all-around integrated circuit structures having vertically discrete source or drain structures, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, the first epitaxial source or drain structure including vertically discrete portions aligned with the vertical arrangement of horizontal nanowires. A second epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, the second epitaxial source or drain structure including vertically discrete portions aligned with the vertical arrangement of horizontal nanowires.
Information query
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