- 专利标题： Structures and methods for electrically connecting printed components
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申请号： US17372314申请日： 2021-07-09
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公开(公告)号： US11527691B2公开(公告)日： 2022-12-13
- 发明人: Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson
- 申请人： X Display Company Technology Limited
- 申请人地址： IE Dublin
- 专利权人： X Display Company Technology Limited
- 当前专利权人： X Display Company Technology Limited
- 当前专利权人地址： IE Dublin
- 代理机构： Choate, Hall & Stewart LLP
- 代理商 Michael D. Schmitt
- 主分类号： H01L33/62
- IPC分类号： H01L33/62 ; H01L23/48 ; H01L23/498 ; H01L23/52
摘要：
A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.
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