-
公开(公告)号：US20240292543A1
公开(公告)日：2024-08-29
申请号：US18660812
申请日：2024-05-10
CPC分类号： H05K3/303 , B41M1/26 , B41M3/00 , H05K1/167 , H05K2203/0147 , H05K2203/0502
摘要： A device source wafer includes a wafer substrate, devices formed on or in the wafer substrate at a location on the wafer substrate, and test structures disposed on the wafer substrate connected to some but not all of the devices. The devices include a first device disposed at a first location and a second device disposed at a second different location on the wafer substrate. The test structures include at least a first test structure connected to the first device and a second test structure connected to the second device. The first test structure is adapted to measuring a characteristic of the first device and the second test structure is adapted to measuring the characteristic of the second device. An estimated characteristic of unmeasured devices is derived from the first and second device locations and measured characteristics and the device is selected based on the estimated characteristic.
-
公开(公告)号：US12074583B2
公开(公告)日：2024-08-27
申请号：US17317408
申请日：2021-05-11
发明人： Matthew Alexander Meitl , Christopher Andrew Bower , Salvatore Bonafede , Carl Ray Prevatte, Jr. , Ronald S. Cok , Brook Raymond
CPC分类号： H03H9/0509 , B41F16/00 , H03H3/02 , H03H9/105
摘要： A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
-
公开(公告)号：US12057541B2
公开(公告)日：2024-08-06
申请号：US18056106
申请日：2022-11-16
CPC分类号： H01L33/62 , H01L25/0753 , H05B45/20
摘要： A white-light-emitting inorganic light-emitting-diode (iLED) structure comprises first iLEDs electrically connected in series, each first iLED emitting a different color of light from any other first iLED when electrical power is provided to the first iLEDs, and a second iLED electrically connected to one of the first iLEDs, the second iLED emitting the same color of light as the one of the first iLEDs when electrical power is provided to the first iLEDs. The second iLED can be electrically connected in series or in parallel with the one of the first iLEDs. Such iLED structures can be used at least in displays, lamps, and indicators.
-
公开(公告)号：US20240177649A1
公开(公告)日：2024-05-30
申请号：US18060486
申请日：2022-11-30
发明人： Imre Knausz , Ronald S. Cok
CPC分类号： G09G3/32 , G09G3/2096 , G09G3/2018 , G09G2310/08 , G09G2320/0626
摘要： A system with dimming control includes a luminance signal, a variable-frequency-clock signal generator responsive to the luminance signal operable to generate a variable-frequency clock signal, a pixel-control signal generator responsive to the variable-frequency clock signal operable to generate a pixel-control signal, and a pixel including a light emitter responsive to the pixel-control signal. The pixel-control signal can be a temporally modulated signal such as a pulse-width modulation signal or a pulse-density modulation signal. A display can comprise an array of pixels and a display controller. The pixel or the display controller can include the variable-frequency clock signal or the pixel-control signal generator, or both.
-
公开(公告)号：US20240105698A1
公开(公告)日：2024-03-28
申请号：US18532431
申请日：2023-12-07
发明人： Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson , Erik Paul Vick
CPC分类号： H01L25/167 , H01L23/481 , H01L25/50 , H01L27/15 , H01L33/54
摘要： An example of a pixel module comprises a module substrate having light emitters disposed on a light-emitter surface and a controller disposed on a controller surface opposed to the light-emitter surface. At least one module electrode is electrically connected to the controller and at least one module electrode is electrically connected to each light emitter. An example of a pixel-module wafer comprises a module source wafer comprising sacrificial portions and module anchors, each sacrificial portion laterally separated from an adjacent sacrificial portion by a module anchor and a pixel module disposed entirely over each sacrificial portion. At least one module tether physically connects each of the pixel modules to at least one of the module anchors. An example of a pixel-module display comprises a display substrate, pixel modules disposed on the display substrate and display electrodes disposed on the display substrate, each display electrode electrically connected to a module electrode.
-
公开(公告)号：US20240066905A1
公开(公告)日：2024-02-29
申请号：US18387643
申请日：2023-11-07
发明人： Tanya Yvette Moore , David Gomez , Christopher Andrew Bower , Matthew Alexander Meitl , Salvatore Bonafede
CPC分类号： B41K3/04 , B41F16/00 , G03F7/0002
摘要： A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
-
公开(公告)号：US11916179B2
公开(公告)日：2024-02-27
申请号：US17703071
申请日：2022-03-24
IPC分类号： H01L33/00 , H01L33/62 , H01L23/00 , H01L25/075 , H01L33/22
CPC分类号： H01L33/62 , H01L24/08 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L33/22 , H01L2224/08238 , H01L2224/32225 , H01L2224/80815 , H01L2224/83862 , H01L2933/0066
摘要： A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.
-
公开(公告)号：US11850874B2
公开(公告)日：2023-12-26
申请号：US16835159
申请日：2020-03-30
发明人： Tanya Yvette Moore , David Gomez , Christopher Andrew Bower , Matthew Alexander Meitl , Salvatore Bonafede
CPC分类号： B41K3/04 , B41F16/00 , G03F7/0002
摘要： A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
-
公开(公告)号：US11817434B2
公开(公告)日：2023-11-14
申请号：US17703135
申请日：2022-03-24
发明人： Christopher Andrew Bower , Matthew Alexander Meitl , Glenn Arne Rinne , Justin Walker Brown , Ronald S. Cok
IPC分类号： H01L33/00 , H01L25/075 , H01L33/62 , H01L33/44
CPC分类号： H01L25/0753 , H01L33/44 , H01L33/62
摘要： A display comprises a transparent polymer support, an array of light emitters embedded in the support, and a redistribution layer. Each light emitter comprises electrode contacts that are substantially coplanar with a back surface of the support and emits light through a front surface of the support opposite the back surface when provided with power through the electrode contacts. The redistribution layer comprises a dielectric layer that is disposed on and in contact with the support back surface and distribution contacts that extend through the dielectric layer. Each of the distribution contacts is electrically connected to an electrode contact and is at least partially exposed.
-
公开(公告)号：US11817040B2
公开(公告)日：2023-11-14
申请号：US17715480
申请日：2022-04-07
CPC分类号： G09G3/32 , G09G2300/08 , G09G2300/0842
摘要： A flat-panel display comprises a display substrate, an array of pixels distributed in rows and columns over the display substrate, the array having a column-control side, and column controller disposed on the column-control side of the array providing column data to the array of pixels through column-data lines. In some embodiments, rows of pixels in the array of pixels form row groups and each column of pixels in a row group receives column data through a separate column-data line. In some embodiments, each pixel in each column of pixels in the array of pixels is serially connected and each pixel in the array of pixels comprises a token-passing circuit for passing a token through the serially connected column of pixels.
-
-
-
-
-
-
-
-
-
搜索结果
191 条记录 (耗时 0.033 秒)
