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公开(公告)号：US11568796B1
公开(公告)日：2023-01-31
申请号：US17388823
申请日：2021-07-29
发明人： Murat Ozbas , Matthew Alexander Meitl , Christopher Andrew Bower , Lee B. Baker , Robert R. Rotzoll , Mike C. Chiu , Ronald S. Cok
摘要： A current-selectable light-emitting-diode (LED) display includes pixels distributed in an array of rows and columns. The pixels are grouped in mutually exclusive clusters and cluster controllers are connected to each pixel in a cluster of pixels to control the pixels in the cluster to emit light. Each cluster controller comprises a selectable current source. Each of the selectable current sources can include cluster current sources that are responsive to a current-select signal to enable one or more of the cluster current sources. The pixels can include micro-LEDs and the cluster controller can be disposed between the micro-LEDs. The display can be disposed on a display substrate with signal wires. The signal wires can include separate wire segments that are electrically connected through regeneration circuits that regenerate the signals. The display can be an information display or a backlight.
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公开(公告)号：US20220392388A1
公开(公告)日：2022-12-08
申请号：US17824973
申请日：2022-05-26
摘要： An interpolated flat-panel display comprises a display substrate and an array of clusters disposed on the display substrate. Each cluster comprises an exclusive group of display pixels and a cluster controller for controlling the display pixels. The cluster controller is operable to receive input data specifying a desired light output from one or more but fewer than all of the display pixels in the group of display pixels, calculate interpolated data at least in part from the input data, and drive the display pixels to emit light in response to the calculated interpolated data and received input data. The input data can correspond to an image pixel in an input image. The cluster controller can be operable to receive a parameter value describing attributes of a local portion of the input image including the image pixel and the interpolated data is calculated at least in part from the parameter value.
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公开(公告)号：US20220301486A1
公开(公告)日：2022-09-22
申请号：US17207300
申请日：2021-03-19
发明人： Matthew Alexander Meitl , Christopher Andrew Bower , Ronald S. Cok , Robert R. Rotzoll , Lee B. Baker
摘要： A pulse-density-modulation display and image capture system comprises a display comprising a plurality of pixels. Each pixel comprises a light emitter that controllably emits light at a constant current for a variable amount of time and a control circuit connected to the light emitter to control the light emitter to emit light in response to an input signal specifying the desired luminance of the light emitter. The control circuit converts the input signal to a non-contiguous pulse-density-modulation signal and controls the light emitter to emit light in response to the non-contiguous pulse-density-modulation signal with a temporally variable constant-current control signal. Each pixel emits light responsive to a display timing signal. The pulse-density-modulation display and image capture system also comprises a sampling camera that records the pixels and is responsive to a camera timing signal different from the display timing signal.
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公开(公告)号：US20220232707A1
公开(公告)日：2022-07-21
申请号：US17705763
申请日：2022-03-28
摘要： An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.
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公开(公告)号：US11315909B2
公开(公告)日：2022-04-26
申请号：US16723770
申请日：2019-12-20
发明人： Christopher Andrew Bower , Matthew Alexander Meitl , Glenn Arne Rinne , Justin Walker Brown , Ronald S. Cok
IPC分类号： H01L33/00 , H01L25/075 , H01L33/62 , H01L33/44
摘要： A display comprises a transparent polymer support, an array of light emitters embedded in the support, and a redistribution layer. Each light emitter comprises electrode contacts that are substantially coplanar with a back surface of the support and emits light through a front surface of the support opposite the back surface when provided with power through the electrode contacts. The redistribution layer comprises a dielectric layer that is disposed on and in contact with the support back surface and distribution contacts that extend through the dielectric layer. Each of the distribution contacts is electrically connected to an electrode contact and is at least partially exposed.
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公开(公告)号：US11309197B2
公开(公告)日：2022-04-19
申请号：US16672399
申请日：2019-11-01
IPC分类号： H01L21/67 , H01L21/68 , H01L21/66 , H01L21/683 , H01L25/075
摘要： An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.
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公开(公告)号：US11282786B2
公开(公告)日：2022-03-22
申请号：US16702352
申请日：2019-12-03
发明人： Erich Radauscher , Ronald S. Cok , Matthew Alexander Meitl , Christopher Andrew Bower , Christopher Michael Verreen , Erik Paul Vick
IPC分类号： H01L23/525 , H01L23/528 , H01L23/544 , H01L27/12
摘要： A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
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公开(公告)号：US20220085235A1
公开(公告)日：2022-03-17
申请号：US17531567
申请日：2021-11-19
摘要： A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.
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公开(公告)号：US11101417B2
公开(公告)日：2021-08-24
申请号：US16532591
申请日：2019-08-06
发明人： Christopher Andrew Bower , Matthew Alexander Meitl , Ronald S. Cok , Salvatore Bonafede , Brook Raymond , Andrew Tyler Pearson
IPC分类号： H01L33/62 , H01L23/48 , H01L23/498 , H01L23/52
摘要： A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.
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公开(公告)号：US20210259114A1
公开(公告)日：2021-08-19
申请号：US17245986
申请日：2021-04-30
发明人： David Gomez , Christopher Andrew Bower , Raja Fazan Gul , António José Marques Trindade , Ronald S. Cok
摘要： A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
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