Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16659744Application Date: 2019-10-22
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Publication No.: US11532461B2Publication Date: 2022-12-20
- Inventor: Michishige Saito , Shota Kaneko , Shuhei Yamabe
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-199512 20181023,JPJP2019-148135 20190809
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/44 ; C23C16/54
Abstract:
A substrate processing apparatus includes a processing vessel; a placing table provided within the processing vessel and configured to place a substrate thereon; and a component disposed between the processing vessel and the placing table, the component constituting an anode. The component has a flow path through which a heat exchange medium flows.
Information query
