- Patent Title: Surface treatment method for copper or copper alloy, surface treatment liquid for sterilizing copper or copper alloy, and sterilization method using copper or copper alloy treated by said method
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Application No.: US16627867Application Date: 2018-05-30
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Publication No.: US11535939B2Publication Date: 2022-12-27
- Inventor: Akiko Yamamoto , Keiichiro Oishi , Shinji Tanaka
- Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Applicant Address: JP Ibaraki
- Assignee: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Current Assignee: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
- Current Assignee Address: JP Ibaraki
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-130373 20170703
- International Application: PCT/JP2018/020675 WO 20180530
- International Announcement: WO2019/008950 WO 20190110
- Main IPC: C23C22/05
- IPC: C23C22/05 ; A01N37/20 ; A61L2/235 ; A61L2/238 ; C22C9/04 ; C22C9/10

Abstract:
The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.
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