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公开(公告)号:US12071693B2
公开(公告)日:2024-08-27
申请号:US17990028
申请日:2022-11-18
Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
Inventor: Akiko Yamamoto , Keiichiro Oishi , Shinji Tanaka
Abstract: The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.
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公开(公告)号:US11535939B2
公开(公告)日:2022-12-27
申请号:US16627867
申请日:2018-05-30
Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
Inventor: Akiko Yamamoto , Keiichiro Oishi , Shinji Tanaka
Abstract: The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.
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