Invention Grant
- Patent Title: Memory system design using buffer(s) on a mother board
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Application No.: US17316586Application Date: 2021-05-10
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Publication No.: US11537540B2Publication Date: 2022-12-27
- Inventor: Chi-Ming Yeung , Yoshie Nakabayashi , Thomas Giovannini , Henry Stracovsky
- Applicant: Rambus Inc.
- Applicant Address: US CA San Jose
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F13/16
- IPC: G06F13/16 ; G06F13/40 ; G06F13/42

Abstract:
A mother board topology including a processor operable to be coupled to one or more communication channels for communicating commands. The topology includes a first communication channel electrically coupling a first set of two or more dual in-line memory modules (DIMMs) and a first primary data buffer on a mother board. The topology includes a second communication channel electrically coupling a second set of two or more DIMMs and a second primary data buffer on the mother board. The topology includes a third channel electrically coupling the first primary data buffer, the primary second data buffer, and the processor.
Public/Granted literature
- US20210326279A1 MEMORY SYSTEM DESIGN USING BUFFER(S) ON A MOTHER BOARD Public/Granted day:2021-10-21
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