Invention Grant
- Patent Title: Molded printhead
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Application No.: US16991524Application Date: 2020-08-12
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Publication No.: US11541659B2Publication Date: 2023-01-03
- Inventor: Silam J Choy , Michael W Cumbie , Devin Alexander Mourey , Chien-Hua Chen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- Priority: WOPCT/US2013/028216 20130228,WOPCT/US2013/046065 20130617
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; B41J2/155 ; B41J2/175
Abstract:
In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
Public/Granted literature
- US20200369031A1 MOLDED PRINTHEAD Public/Granted day:2020-11-26
Information query
IPC分类:
