-
公开(公告)号：US11383230B2
公开(公告)日：2022-07-12
申请号：US16085253
申请日：2016-03-31
发明人： Jeffrey A. Nielsen , Michael W. Cumbie , Devin Alexander Mourey , Silam J. Choy , Kenneth Ward , Christie Dudenhoefer
IPC分类号： B01L3/02
摘要： A digital dispense apparatus includes at least one fluid dispense device, at least one reservoir fluidically connected to the at least one fluid dispense device, a monolithic carrier structure carrying the at least one fluid dispense device and reservoir, the monolithic carrier forming fluid routing between the reservoir and the fluid dispense device.
-
公开(公告)号：US11325378B2
公开(公告)日：2022-05-10
申请号：US17083156
申请日：2020-10-28
摘要： In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.
-
公开(公告)号：US20200369031A1
公开(公告)日：2020-11-26
申请号：US16991524
申请日：2020-08-12
摘要： In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
-
公开(公告)号：US20200331259A1
公开(公告)日：2020-10-22
申请号：US16092978
申请日：2016-07-21
摘要： A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.
-
公开(公告)号：US10369793B2
公开(公告)日：2019-08-06
申请号：US15747619
申请日：2015-10-15
摘要： In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.
-
公开(公告)号：US20190118540A1
公开(公告)日：2019-04-25
申请号：US16092547
申请日：2016-04-21
摘要： A fluid level sensing device includes a substrate (210) and a sensing die (216) cantilevered at one end from the substrate. A number of sensing components (218), preferably thermal or impedance sensing components, are disposed on the sensing die and detect a fluid level in a fluid reservoir. A protective member (208) is also cantilevered at one end from the substrate alongside the sensing die. Electrical interconnects (212) output data collected from the number of sensing components. A number of sensing dies may be provided to lengthen the sensing device, in which case the protective cover extends alongside and parallel to the number of sensing dies.
-
公开(公告)号：US11541659B2
公开(公告)日：2023-01-03
申请号：US16991524
申请日：2020-08-12
摘要： In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
-
公开(公告)号：US11326200B2
公开(公告)日：2022-05-10
申请号：US16094360
申请日：2016-07-22
摘要： A method of preparing a sample may include depositing an aqueous solution comprising copies of a primer into a layer of hydrophobic liquid on a substrate with a thermal inkjet device. A sample may include: a substrate; a layer of hydrophobic liquid on the substrate, the layer of hydrophobic liquid comprising a plurality of droplets of aqueous solution distributed in the layer, wherein the plurality of droplets contain: primers; a polymerase enzyme; deoxynucleotide triphosphates (dNTPs); and a target sequence for replication; and a cover, the cover contacting and covering the layer of hydrophobic liquid.
-
公开(公告)号：US20210039390A1
公开(公告)日：2021-02-11
申请号：US17083156
申请日：2020-10-28
摘要： In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.
-
公开(公告)号：US10815121B2
公开(公告)日：2020-10-27
申请号：US16099020
申请日：2016-07-12
摘要： A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.
-
-
-
-
-
-
-
-
-
搜索结果
43 条记录 (耗时 0.017 秒)
